Job Description:Â Â
Being responsible for SRAM memory device development, you will join a small development team with talented and driven contributors to deliver high-density, production-worthy, reliable memory technology on schedule and within budget. You will work with development wafer fabrication facilities to manage device definition, creation, demonstration, and delivery and work with multiple design groups to capture requirements and to evaluate tradeoffs providing a unique opportunity to create SRAM memory solutions for TI customers. Highly visible position interacting with multiple business groups, development groups, and fabrication facilities. You will be involved in innovative pathfinding projects.
Opening is within Advanced Technology Development Department of the Technology and Manufacturing Group. Responsibilities include SRAM bitcell design, process integration, SWR/DOE (experiments) definition and generation, test structure definition, characterization, data analysis, design rule generation, process control document generation, device characterization, device simulation, driving SRAM yield and qualification. Â
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TI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin. However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this position without first obtaining an export license, TI expressly reserves the right not to seek such a license for you and either offer you a different position that does not require an export license or decline to move forward with your employment.
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