Back Grind/Back Metal Post Fab Engineer

onsemi is seeking a highly motivated engineer to work in our Technology Development group as a Process Integrator focused on wafer thinning and backmetal development on new CMOS, BCD, Image Sensor, and other new/novel technologies.  This will include driving continuous improvement on new processes, new product architecture and technologies, Yield and Performance improvements, and New Product/Technology Introduction and ramp to volume manufacturing. 

Responsibilities

Essential Responsibilities: 

• Support new semiconductor technology from early development phase through volume manufacturing phase, including full documentation to support ONSEMI’s process change review process. 
• Work with a global matrixed team while driving projects and results independently. 
• Effectively communicating with all levels of the organization, including the executive staff.
• Operating independently, while taking high-level objectives into account.
• A team player with strong listening skills who can take input and make informed decisions.
• Using probe, in-line test, and failure analysis data to develop and drive process improvements. 
• Drive cost reduction through yield enhancement and process simplification.

Qualifications

Required Qualifications: 

• Demonstrated understanding of Semiconductor technology, manufacturing, new product development, device, and yield improvement.
• Education:  BS in Engineering or Material Science, MS or PhD preferred  
• Experience: 6-10 years or more relevant experience in semiconductor manufacturing integration and technology development. 
• Proven experience and a deep knowledge and understanding of wafer thinning and back-metal processes, including bond/debond, grind, silicon wet etch, PVD, plating, TSV, RDL, etc.
• Proven experience and a deep knowledge and understanding of power semiconductors, CMOS, and BCD integration is preferred. 
• Assembly processing and advanced module construction are positive.
• Proficiency in SW tools such as MS Excel, PowerPoint, Word, MS Project, and Yield analysis tools such as Excensio, Spotfire, JMP, Minitab, etc.
• Knowledge and proven experience with DOE, 6-sigma, Lean, models-based problem solving, 5S, 8D, SPC, DOE, FMEA 
• Ability to influence and lead decisions on capital equipment to enhance new technology capabilities and execution.
• Knowledge of assembly and package interconnect processes preferred.
• Experience using predictive thermo-mechanical simulations is preferred.
• Language Fluency – Fluent in English Language, written & verbal 

Salary: onsemi is excited to share the base salary range for this position is $114.000 to $193,700 exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of the internal equity of our current team members. We also offer a competitive benefits package. https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf