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About the role
Own different aspects of Packaging including Design Layout, SI/PI and Thermo-mechanical aspects. Work with chip-design and software teams driving DensityAI's AI accelerator program from first silicon through scale-out.
What you'll do
- Own different aspects of Packaging including Design Layout, SI/PI and thermo-mechanical aspects
- Use and develop AI-assisted tool flows to accelerate package design and signoff timelines
What we're looking for
- Exceptional abilities across the full advanced packaging design and tradeoffs
- 10+ years of experience on very high performance designs at advanced packaging like SIP, CoWoS, EMIB and other interposer technologies
- Hands-on with industry-standard packaging tools and flows for multi-die packaging (including 2.5D/3D)
- Demonstrated ability to work closely with architects to create right packaging solutions and sign off complex packaging solutions
- (Optional) DFT-aware packaging design, RTL and PD flows
Compensation
Final offers depend on level, location, and skills relevant to the role. Additional compensation: equity grant per company guidelines; medical / dental / vision; 401(k); standard PTO.Â
Visa Sponsorship
DensityAI sponsors qualified candidates for H-1B, O-1, TN, E-3, and other employment-based visas, and we welcome applicants on F-1 OPT and STEM-OPT. Work authorization is required at start; we provide immigration support to secure or transfer status.
Export Controls
Aspects of this role may involve access to information subject to U.S. export controls (EAR/ITAR). We may discuss licensing or scope adjustments during the interview.
Equal Opportunity
DensityAI is an Equal Opportunity Employer. We do not discriminate on the basis of race, color, religious creed, national origin, ancestry, physical or mental disability, medical condition, genetic information, marital status, sex, gender, gender identity, gender expression, age (40+), sexual orientation, military or veteran status, pregnancy, or any other status protected by law. We comply with the California CROWN Act and provide reasonable accommodations on request.
Full compensation packages are based on candidate experience and relevant certifications.Â
Compensation
Final offers depend on level, location, and skills relevant to the role. Additional compensation: equity grant per company guidelines; medical / dental / vision; 401(k); standard PTO.Â
Visa Sponsorship
DensityAI sponsors qualified candidates for H-1B, O-1, TN, E-3, and other employment-based visas, and we welcome applicants on F-1 OPT and STEM-OPT. Work authorization is required at start; we provide immigration support to secure or transfer status.
Export Controls
Aspects of this role may involve access to information subject to U.S. export controls (EAR/ITAR). We may discuss licensing or scope adjustments during the interview.
Equal Opportunity
DensityAI is an Equal Opportunity Employer. We do not discriminate on the basis of race, color, religious creed, national origin, ancestry, physical or mental disability, medical condition, genetic information, marital status, sex, gender, gender identity, gender expression, age (40+), sexual orientation, military or veteran status, pregnancy, or any other status protected by law. We comply with the California CROWN Act and provide reasonable accommodations on request.
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