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Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our innovative team is helping connect, protect and power our planet.
RESPONSIBILITIES
- Principal level Mechanical/Thermal Engineer developing next generation microelectronic packaging technology with emphasis on structural analysis
- Chosen candidate will work closely with select team of IC designers, module designers, process engineers, and CAD tool set specialists to develop products and development tools to move state of the art packaging technology forward
- Using FEA and other industry standard simulations tools:
- Perform detailed modeling and optimization of packaging design at the die/package/board level
- Develop and execute thermal and mechanical stress measurement techniques to support analysis for internal and external customers
- Guide package and substrate design decisions that meet performance specifications and yield requirements
- Supervise and respond to manufacturing issues as they occur
- Maintain view of packaging technology trends across GaN, GaAs, Digital Si, and Analog Si. Provide inputs to implement these technology trends
- Support external customers with applications models and failure analysis support
QUALIFICATIONS:
- BSME/MSME degree in mechanical engineering or other relevant field with a minimum of 12 years’ experience in semiconductor packaging
- Experience in the design of packaged microelectronic assemblies for the defense, avionics, aerospace, or automotive industries
- Expert level skill with ANSYS and Solidworks, or similar
- Expert knowledge of legacy and advanced microelectronic package technologies for commercial, defense, and aerospace markets including materials, manufacturing methods, plating, sealing, and interconnect technologies
- Experience with microelectronic package assembly processes including die attach, wire bond, flip chip, epoxy dispense, encapsulation, and solder reflow
- Knowledge of microelectronic inspection tools and equipment including capabilities and limitations. Similar knowledge of failure analysis techniques and equipment
- Knowledge of reliability calculation methods for semiconductors
- Understanding of GD&T, ANSI standards and tolerance stack-ups required
- Demonstrated ability to work with cross-functional teams
- Excellent verbal communication and interpersonal skills
- Excellent written communications skills
This position is not eligible for visa sponsorship by the Company.
This position requires work on US Government contracts. Applicants must be a US Person (US citizen, permanent resident, asylee or refugee).
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MAKE A DIFFERENCE AT QORVO
We are Qorvo. We do more than create innovative RF and Power solutions for the mobile, defense and infrastructure markets – we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.
We are an Equal Employment Opportunity (EEO) employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to any characteristics protected by applicable law, including race, color, religion, sex (as defined by law), national origin, age, military or veteran status, genetic information, or disability.
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