Job/Position Summary

The Copper Plating Engineer will develop, optimize, and support copper electroplating and electroless plating processes. This role is ideal for an engineer who enjoys working directly with tools and chemistries, running experiments, solving problems quickly, and contributing across R&D and early manufacturing environments.

Primary Responsibilities

Develop and optimize ABF and DFR lamination processes for advanced packaging applications.
Run experiments to improve lamination quality, adhesion, and yield.
Support DFR exposure and development processes and chemistry control.
Troubleshoot adhesion loss, voiding, wrinkling, delamination, warpage, and defectivity.
Develop and maintain ABF/DFR adhesion to glass and copper surfaces.
Support ABF laser structuring and via formation processes.
Set up, qualify, and maintain ABF/DFR lamination and exposure equipment.
Work closely with integration, laser, plating, and reliability teams.
Collect and analyze process data; apply DOE and root cause analysis to drive improvements.
Support scale-up from R&D to pilot and early manufacturing environments.
Perform additional functions and other duties as assigned or required.

Requirements

Bachelor’s degree in Chemical Engineering, Materials Science, Mechanical Engineering, or related field required.
2-5 years of experience in copper plating or advanced packaging process engineering.
Panel-level plating experience is desired.
An advanced packaging or heterogeneous integration background is desired.
Willing to relocate to Albuquerque, New Mexico, for 1-2 years and willing to relocate to India for 2 years or permanently.

This position will require lawful access to ITAR/EAR controlled information, and employees in these roles will need to meet those requirements. Requirements include US Citizenship, US Permanent Resident, or the ability to meet contract-specific licensure requirements.

Knowledge, Skills, and Abilities

Strong experimental skills and data-driven problem-solving approach.
Comfortable working in a startup environment with evolving requirements.
Ability to work independently and across disciplines.
Strong experimental design and data analysis skills.
Proven track record of solving complex plating and integration challenges.
Hands-on experience with copper electroplating chemistries
Familiarity with plating chemistry additives (suppressors, accelerators, levelers)
Experience using electroplating waveforms (DC, pulse, pulse-reverse)
Understanding of electroless copper plating and copper seed layer formation
Experience with plating tools and wet benches
Knowledge of defect mechanisms and process control in copper plating
Excellent communication and mentoring skills.
Experience scaling processes from R&D to pilot or production is desired.
Familiarity with SPC, FMEA, and yield analysis and methodologies is desired.

Physical/Working Requirements

Must be able to wear personal protective gear most of the day (where applicable)
Prolonged periods of sitting or standing

Behavioral Traits

Strong verbal and written communication skills to convey quality standards, expectations, and feedback clearly to team members and stakeholders.
A willingness to adjust to changing circumstances, processes, or technologies for continuous improvement in dynamic environments.
The ability to work well with others, fostering a cooperative atmosphere, driving data management initiatives, and engaging all levels of the organization.

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