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Requisition ID: R10158925
- Category: Engineering
- Location: Baltimore, Maryland, United States of America
- Clearance Type: Top Secret
- Telecommute: No- Teleworking not available for this position
- Shift: 1st Shift (United States of America)
- Travel Required: Yes, 10% of the Time
- Relocation Assistance: Relocation assistance may be available
- Positions Available: 1
Northrop Grumman Space Systems sector delivers a decisive advantage to its customers through software-defined, hardware-enabled solutions. The Electrical Design and Analysis (EDA) section in Baltimore, MD enables these hardware solutions by providing RF microwave architecture, design, verification, and support expertise across a wide variety of electronic sensor products. Our engineers work on complex, leading edge, high reliability electronics supporting different space platforms.
NGSS engineers share a great sense of pride knowing their contributions have a direct effect on the safety and security of the country and its allies. Our culture thrives on intellectual curiosity, cognitive diversity, teamwork, and bringing your whole self to work to accomplish the mission while learning and having fun along the way. Our department is fertile ground for all experience levels to become part of our growing team and contribute to our goals. The department offers opportunities to grow on a technical track both broad and deep as well as explore project leadership or management positions. This role will support our Payload and Ground Systems Division and Remote Sensing Programs (RSP) Business Unit.
EDA is seeking engineers with experience and interest in RF/Microwave and Mixed Signal circuit card assembly (CCA) design and test including:
Designing, modeling, and verifying RF/microwave and mixed signal CCAs, particularly Digital Receiver/Exciters
Utilize analysis, simulations and prototyping to develop CCA designs
Managing RF budgets, frequency planning, and common assembly level interfaces
Predicting assembly level performance through selecting materials, components, and packaging approaches, RF chain analysis, electromagnetic simulation, data collection and analysis, and other modeling techniques
Principal RF/Microwave Design Engineer Basic Qualifications:
Bachelor Degree in Electrical Engineering or comparable STEM degree minimum of 5 years of relevant engineering experience (3+ years with MS degree; or PhD)
Proficient in RF/Microwave and mixed signal circuit design, schematic capture, and PWB/board layout
Completed and/or led multiple board designs from schematic capture to board release
Experience in test and troubleshooting complex mixed signal CCAs
Ability to provide solutions to a broad variety of RF/Microwave design and test related problems of complex difficulty
Exhibit intermediate to expert proficiency with industry standard RF/Microwave modeling, simulation and printed circuit board design tools (e.g. ANSYS HFSS/Maxwell, CST Microwave, Eagleware/Genesys, Keysight ADS, Xpedition, Altium, FEKO, TICRA)
Be able to work on multi-discipline engineering teams and communicate clearly within integrated product team leads
Easily adapt to design challenges to meet program goals and deadlines
US Citizenship is required
Ability to obtain and maintain a TS/SCI clearance
Sr. Principal RF/Microwave Design Engineer Basic Qualifications:
Bachelor Degree in Electrical Engineering or comparable STEM degree minimum of 9 years of relevant engineering experience (7+ years with MS degree; or 4+ years with PhD)
Proficient in RF/Microwave and mixed signal circuit design, schematic capture, and PWB/board layout
Completed and/or led multiple board designs from schematic capture to board release
Experience in test and troubleshooting complex mixed signal CCAs
Ability to provide solutions to a broad variety of RF/Microwave design and test related problems of complex difficulty
Expert proficiency with industry standard RF/Microwave modeling, simulation and printed circuit board design tools (e.g. ANSYS HFSS/Maxwell, CST Microwave, Eagleware/Genesys, Keysight ADS, Xpedition, Altium, FEKO, TICRA)
Demonstrated Technical Team Leadership and ability to work on multi-discipline engineering teams and communicate clearly within integrated product team leads
Easily adapt to design challenges to meet program goals and deadlines
US Citizenship is required
Ability to obtain and maintain a TS/SCI clearance
Preferred Qualifications:
Active Top Secret / SCI security clearance
Experience in Worst Case Circuit Analysis (WCCA) including logic compatibility, component derating, timing analysis, signal and power integrity analyses
Signal integrity analysis (SERDES, Bit error rates, jitter components and contributors, board to board analysis)
Expertise in working with receiver/exciters, conducting RF performance analysis, and implementing digital beamforming
High-speed digital circuit design experience
Familiarity with Point of Load (PoL) design
Experience in integrating FPGA/Digital controls on the bench (no VHDL experience required)
Understanding of basic signal processing
RF budgeting, frequency planning, RF chain analysis and modeling
Component selection and/or custom component requirements flow down and trades
Ceramic and organic printed circuit board materials, design, fabrication, and assembly processes
Integrated Circuit packaging techniques including chip-and-wire, QFN, flip-chip
Product life cycle support from concept through production support
Designing for high reliability, space requirements and environments
AESA / phased array, Radar, SIGINT, or SATCOM experience
Salary Range 2: $127,000 - $190,600
The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.
Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.
The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.
Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.
