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SoC Physical Design Methodology Engineer

Apple
Posted 2 months ago, valid for 23 days
Location

Beaverton, OR 97076, US

Salary

Competitive

Contract type

Full Time

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Sonic Summary

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  • Apple is seeking a member for their Silicon Technologies group to help design and manufacture high-performance processors and systems-on-chip (SoC).
  • The role involves performing physical verification checks and collaborating with CAD/Technology teams throughout the chip design cycle.
  • Candidates must have a BS degree and at least 3 years of relevant industry experience.
  • Preferred qualifications include experience with physical verification flows, ESD and macro placement design guidelines, and scripting skills in Perl, Python, or Tcl.
  • The position offers a competitive salary, which is commensurate with experience.
At Apple, we work every single day to craft products that enrich people's lives! Do you love creating elegant solutions to highly complex challenges? Do you intrinsically see the importance in every detail? As part of our Silicon Technologies group, you’ll help design and manufacture our next-generation, high-performance, power-efficient processor, system-on-chip (SoC). You’ll ensure Apple products and services can seamlessly and efficiently handle the tasks that make them beloved by millions. Joining our group means you’ll be responsible for crafting and building the technology that fuels Apple’s devices. Together, we will enable our customers to do all the things they love with their devices! In this highly visible role, you will be a part of a critical team responsible for physical verification of an SOC.

Description


• As a member of our physical design team, you will perform various types of physical verification checks (such as LVS, DRC, design-for-manufacturing & design-for-yield, and lithography) at the chip and block level. • You will collaborate with the CAD/Technology teams for flow bring up and validation. We work directly with the implementation team during the entire chip design cycle to drive signoff closure for tapeout. • You will lead schedules and support cross-functional engineering efforts. • You will work on padring, bump, RDL design, and working with the package and floorplan teams.

Minimum Qualifications


BS and 3+ years of relevant industry experience.

Preferred Qualifications


Experienced with physical verification flows such as DRC/LVS/ANT/HVDRC signoff flows and full-chip integration methodology Experience with ESD and macro placement design guidelines, digital and analog mixed signal back-end verification checks and methodology Knowledge of all aspects of ASIC physical design and physical verification checks Scripting skills perl/python/tcl to debug flow related issues and automate checks Experienced in industry standard tools used for physical verification such as Mentor Calibre, Synopsys ICV, etc. Tapeout experience with a track record of successful signoff Layout design experience is a plus



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