Description
Do you have an inventive design approach and enjoy the challenges of miniaturization? As a Microphone Module Engineer, you will be responsible for modeling and analyzing new sensor and actuator technologies to enable new acoustics features across Apple product lines. This will include scoping new MEMS technologies and devising proof-of-concept designs, models, and test-structures. You’ll apply your expertise using analytical, lumped element, and finite element methods. You’ll communicate your findings and takeaways regularly with a diverse multi-functional team working on acoustic modules. This includes regular presentations on status, risk, and mitigation strategies. Ultimately, your efforts will identify useful technologies to travel from the technology development phase to utilization in products. In this role, you will regularly interact with suppliers and sub-contractors to drive technologies that enable new sensor and actuator functionalities, diagnosing engineering issues as you go, driving to definitive root cause. Your creativity and ability to think quickly and dynamically in order solve technical challenges will be key.
Minimum Qualifications
Proven experience in advanced Finite Element Analysis (FEA) within high-volume consumer electronic products and/or modules. Direct experience with MEMS technologies is vital. ANSYS or COMSOL experience required. Deep understanding of multiphysics modeling, including linear and non-linear structural analysis, thermoviscous acoustics, electronics, RF, heat transfer, and magnetics, as applied to mobile devices. Experience characterizing and de-bugging MEMS transducers (sensors or actuators such as IMUs, pressure sensors, microphones, micro-mirrors, etc). Direct experience with electrostatic /piezoelectric transducers. Experience developing simplified models, such as lumped element models, using tools such as Spice, Matlab, Verilog, etc. to develop and validate your design concepts. Expertise designing experiments and analyzing data using tool such as JMP, Matlab, or various scripting approaches to enable analysis of the manufacturability of your designs. Working knowledge of semiconductor and MEMS materials and packaging. International travel (10-15%).
Preferred Qualifications
Experience modeling MEMS-package interactions. Most of our engineers have advanced degrees Mechanical or Electrical Engineering or an equivalent field.
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