This role is for a highly technical Directly Responsible Individual (DRI) who leads the end-to-end lifecycle of semiconductor based display —from initial silicon bring-up and characterization to high-volume manufacturing (HVM). You will integrate hardware expertise in relevant fields (such as semiconductor devices, EE, displays) with advanced data analytics to drive product success.

Responsibilities

Lead the transition of products from design to high-volume manufacturing (HVM). Collaborate with design teams to ensure Design for Test (DFT) and Design for Manufacturing (DFM) requirements are met
Monitor and analyze wafer sort and final test data. Use statistical methods (Gage R&R, SPC) to identify root causes of yield loss and implement corrective actions
Collaborate with system design, packaging, and process teams to resolve integration, reliability, and performance challenges in early-stage prototypes and production systems
Create and perform DoEs to uncover device issues' root cause, propose remedy, get alignment from cross functional partners, and execute to their implementation
Collaborate with Test Engineering to optimize test programs and test methods to reduce test time without compromising quality or coverage
Drive the validation of key performance indicators of integrated display solutions under nominal and corner-case operating conditions
Perform analysis electrical characterization across process corners, voltage, and temperature (PVT) to define datasheet specifications
Define and execute reliability and qualification test plans for new display technologies in accordance with relevant industry standards and technology requirements
Drive root cause investigation of internal and customer returns. Interface with the failure analysis lab to interpret SEM, EDX, or EMMI results
Manage technical relationships with OSAT (Out-Sourced Assembly and Test), CM (Contract Manufacturing), and foundries to ensure manufacturing consistency
Define and create data pipelines and dashboards for commonly referenced metrics and KPIs
facilitate the democratization of data to cross functional teams

Minimum Qualifications

Bachelor's degree in Electrical Engineering, Materials Science, Physics, or equivalent experience
8+ years of experience in semiconductor test engineering, product engineering, reliability/qualification (REL / QUAL), process engineering, or advanced integration and packaging
Experience with analog and digital circuit test development and optical/electrical measurement techniques
Experience with reliability and qualification standards relevant to displays and semiconductor components (JEITA, JEDEC, etc.)
Experience leading cross-functional test engineering, device integration, or REL/QUAL projects
Experienced in programming languages and algorithms such as Python

Preferred Qualifications

Ph.D. or M.S. in Electrical Engineering, Materials Science, Physics, or Analytics
10–20+ years of industrial experience in hardware engineering, with a proven history of leading successful NPI programs at major technology companies
Experience with III-V material physics, especially LEDs and microLEDs
Expertise in advanced semiconductor packaging technologies such as CoWoS, wafer reconstitution, InFO, or Hybrid Bonding
Experience applying Machine Learning algorithms to hardware performance and reliability data
Proficient in data analysis and reporting tools such as JMP or R
Experience building and maintaining automated data pipelines and visualization dashboards (Grafana, Tableau)
Experience in yield analysis, process optimization, or failure analysis for display products
ATE Test Engineering experience

$173,000/year to $245,000/year + bonus + equity + benefits

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Hardware Product Engineer