Responsibilities
- Participate in the development of customized image sensors for future AR/VR/AI devices
- Propose specification/functional requirements for customized image sensors and align with stakeholders inside SSR and cross-functional teams
- Perform schematic design, layout design and pre/post-layout simulations for various circuit blocks in customized image sensors
- Support internal teams to integrate customized image sensors into camera modules and prototyping systems
Minimum Qualifications
- Bachelor's degree in Computer Science, Computer Engineering, relevant technical field, or equivalent practical experience
- Master’s degree in the field of Computer Science, Electrical Engineering or related field
- 10+ years of experience in analog & mixed-signal IC design including ADCs, readout circuits, driving circuits, controlling circuits, I2C/I3C interfaces and high-speed interfaces in advanced CMOS process nodes
- Shipped 1 or more semiconductor products in mass production
- Experience with PCB design
- Experience with chip testing
- Familiar with pixel operating principles for both rolling-shutter and global-shutter image sensors
- Familiar with state-of-the-art 3D stacking process for image sensors fabrication
Preferred Qualifications
- A Ph.D. degree in the field of Computer Science, Electrical Engineering or related field
- Experience with designing image sensors in advanced 3D stacking process
- Experience with designing camera system prototypes
$178,000/year to $250,000/year + bonus + equity + benefits
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