SonicJobs Logo
Left arrow iconBack to search

Photolithography Process Engineer

NXP Semiconductors
Posted 2 months ago, valid for 4 days
Location

Chandler, AZ 85225, US

Salary

Competitive

Contract type

Full Time

By applying, a Sonicjobs account will be created for you. Sonicjobs's Privacy Policy and Terms & Conditions will apply.

SonicJobs' Terms & Conditions and Privacy Policy also apply.

Sonic Summary

info
  • NXP is seeking a Photolithography Process Engineer for its Front End Operations in a high-volume semiconductor wafer manufacturing environment.
  • Candidates must have a BS or MS degree in engineering and over 5 years of process engineering experience in a similar setting.
  • Experience with ASML Scanner, Canon Stepper, and Six-Sigma statistical methodology is highly desirable.
  • The role involves process development, optimization, and collaboration with cross-functional teams to improve manufacturing efficiency.
  • Salary details are not specified, but the position emphasizes the importance of reducing costs and improving tool utilization.

Business Line Description:
NXP’s Front End Operations plays an essential role in the company’s success by ensuring manufacturing excellence and delivery of high quality, scalable, and cost-competitive semiconductor devices to create a winning advantage for our customers. 

Job Summary:

Photolithography Process Engineer in a high-volume semiconductor wafer manufacturing environment. Prior experience with semiconductor manufacturing process is required. Previous experience with ASML Scanner, Canon Stepper, TEL ACT 8 or Mark 7 track, KLA 8100 CDSEM or Archers is highly desirable.

Key Challenges:

  • Reducing overall cost of non-conformal like wafer scrap, and photo rework
  • Developing and writing standard work procedure document for Out of Control Action Plan
  • Implementation of process SPC using Six-Sigma statistical methodology
  • Process development and optimization utilizing Six-Sigma methodology
  • Improving tool utilization and availability
  • Working with manufacturing and industrial engineering for capacity planning and modeling
  • Participating in and/or leading cross-functional and lean activity teams
  • Supporting process development activities
  • Sourcing and process releasing new equipment
  • Training process technician in dispositioning of wafer in process out of control situations
  • Training wafer FAB associate in process tool operation using our standard work process

Cross functional aspects:

  • Working closely with Photo equipment team to identify and reduce source of process variation and implementing zero defect process
  • Collaborate with device team to improve process integration margin

Job Qualifications:

  • Must have a BS or MS degree in engineering or a degree in relevant field of studies
  • More than 5 years of process engineering experience in a similar high volume semiconductor manufacturing environment is preferred
  • Six-Sigma statistical methodology

More information about NXP in the United States...

NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.

#LI-97b2



Learn more about this Employer on their Career Site

Apply now in a few quick clicks

By applying, a Sonicjobs account will be created for you. Sonicjobs's Privacy Policy and Terms & Conditions will apply.

SonicJobs' Terms & Conditions and Privacy Policy also apply.