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Tech Integration Process Engineer

Absolics Inc
Posted 2 months ago, valid for 12 days
Location

Covington, GA 30015, US

Salary

$70,000 - $80,000 per year

Contract type

Full Time

Paid Time Off

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Sonic Summary

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  • Absolics Inc., a leader in advanced packaging technologies located in Covington, GA, is seeking a Tech Integration Junior Engineer to support advanced glass substrate development.
  • The role focuses on process integration, technology validation, and manufacturing readiness, collaborating with cross-functional teams to enhance product yield and optimize processes.
  • Candidates should have a Bachelor's degree in Material Science, Chemical Engineering, or a related field, with 1+ years of experience preferred in semiconductor packaging or related areas.
  • The position offers a salary range of $70,000 to $80,000, along with benefits including 401K matching, healthcare support, and PTO.
  • Applicants must be legally permitted to work in the U.S. and possess strong time management skills in a fast-paced environment.

Company Description

Absolics Inc. is the world’s first glass substrate manufacturer and a leader in advanced packaging technologies. The company provides scalable solutions tailored for businesses in high-performance computing. Absolics pioneers innovative manufacturing techniques to support cutting-edge semiconductor advancements. Located in Covington, GA, the company is positioned at the forefront of the technology industry.

 

Position: TECH INTEGRATION PROCESS ENGINEER

Location: COVINGTON, GA

 

JOB SUMMARY:

We are seeking a Tech Integration Junior Engineer to support advanced Glass substrate development. This role focuses on process integration, technology validation, and manufacturing readiness, ensuring that newly developed processes, materials, and equipment can be successfully implemented in production. The position will collaborate with cross-functional teams to improve product yield, optimize manufacturing processes, and support the transition of new technologies into production.

 

DUTIES/RESPONSIBILITIES:

  • Perform process integration and technology validation for advanced glass substrate development projects
  • Evaluation of manufacturing readiness and support process optimization for production implementation
  • Design and execute DOE (Design of Experiments) and perform data analysis for materials, process conditions, and structural design
  • Optimize process conditions and substrate structures to ensure product performance and process stability
  • Drive engineering projects focused on achieving performance targets and yield improvements
  • Review and support process conditions based on customer specifications and technical requirements
  • Generate technical reports, analysis documents, and project documents for development and evaluation results
  • Monitor industry trends and emerging technologies related to glass substrates and packaging technologies

 

REQUIREMENTS:

  • Manage and coordinate sample development schedules for new process, material, and technology development project
  • Collaborate with cross-functional teams to address process, quality and technical issues and support effective issue resolution
  • Perform defect analysis and root cause analysis for process abnormalities and product defects
  • Collect, organize, and analyze evaluation data using statistical methodologies
  • Utilize data analysis tools such as Excel, JMP, or Minitab for data processing and statistical analysis
  • Prepare technical reports and analysis documents based on evaluation and analysis result

 

QUALIFICATIONS:

  • Must be legally permitted to work in the United States
  • Ability to learn and pick up new technologies very quickly
  • Exceptional time management skills with the ability to work in a fast-paced environment

 

EDUCATION:

  • Bachelor’s degree or higher in Material Science, Chemical Engineering, or a related engineering field

 

EXPERIENCE:

  • 1 + years of experience preferred but not required in semiconductor packaging, substrate development, or processing engineering
  • Experience in Semiconductor, PCB, or OSAT industries is a plus

 

SALARY:

  • $70,000 – $80,000

 

BENEFIT:

  • 401K 6% matching (NO vesting period)
  • Healthcare 100% support (Health, Dental, Vision)
  • Life, STD, LTD 100 % support
  • Cell phone allowance
  • PTO and self-development

 

 

 

 




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