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Description
This position blends finite element simulation with hands-on materials characterization. You will work on semiconductor packages, PCB systems, and SMT assemblies — developing predictive models that inform design direction, reliability strategy, and manufacturing readiness. You’ll partner closely with design, reliability, and manufacturing teams to define key load cases, build and validate material models, and reduce risk early in development. Your work will help close the gap between simulation and hardware through disciplined experimentation and correlation.
Minimum Qualifications
7+ years of experience in finite element modeling Strong foundation in solid mechanics and thermomechanics Experience with CAE tools such as Ansys, Abaqus, or equivalent Experience working with materials used in microelectronics applications MS or PhD in Mechanical Engineering, Materials Science, Applied Mechanics, Chemical Engineering, or related field
Preferred Qualifications
Experience in warpage, fracture mechanics, fatigue, or drop/impact modeling Familiarity with semiconductor packaging and SMT processes Experience correlating simulation models with physical testing Understanding of DOE methodology and reliability physics Strong written and verbal communication skills Comfortable working in a fast-paced, cross-functional environment
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