Description
This candidate will be responsible for Apple SoC/Application Processor Product and Package Reliability. Candidate will work closely with cross functional teams and subcontractors to coordinate the introduction of new AP products and ensure product manufacturability. - Drive SoC/AP product, process and package qualification and reliability tests. - Drive Failure analysis during product or package qualification. - Experience applying JEDEC quality related standards, ISO and the science behind them. - Must know reliability fail modes of silicon / packaging technologies and fail mechanisms with respect to reliability. - Experience with reliability HW and Stress Pattern setups and equipment for life, environmental, ESD, Latch-Up testing. - Implement ongoing quality improvement processes working with the suppliers.
Minimum Qualifications
BS with 10+ years of relevant industry experience
Preferred Qualifications
Ideal candidate will have relevant experience with SoC Reliability engineering Hands on SoC product and package reliability testing Familiar with preparation for Qualification including BIB/Socket, waveform, electrical bias, thermal effect, lifetime estimation. Set-up HTOL testing Set-up ESD and Latch Up test Device Reliability FA experience Driving foundries for product reliability issue
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