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Senior Engineer I, AS Field Application

Kulicke & Soffa
Posted 10 days ago, valid for 20 days
Location

Fort Washington, PA, US

Salary

Competitive

Contract type

Full Time

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Sonic Summary

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  • The position involves collaborating with customers to develop and optimize advanced packaging processes for semiconductor manufacturing.
  • Candidates should have at least 5 years of experience in semiconductor packaging and troubleshooting.
  • The role requires serving as the lead technical interface for customers, helping them with packaging recipes and equipment usage.
  • The salary for this position is competitive and commensurate with experience.
  • Additionally, the candidate will need to communicate daily with customers, prepare reports, and escalate issues to the engineering team for resolution.

Responsibilities

 

  • Work closely with our customers to develop and optimize advanced packaging processes for semiconductor manufacturing 
  • Serve as the lead technical interface for customers, helping them develop and optimize their packaging recipes
  • Troubleshoot and repair semiconductor packaging equipment, perform preventive maintenance (PM) on the machines when needed and train the customer engineers to use the equipment
  • Communicate and align with the customer on a daily basis, prepare internal summary reports and customer presentations
  • Escalate issues to the rest of the engineering team at other sites and work closely with them for resolutions
  • Collaborate closely with the engineering team to support, maintain, and enhance machine performance, implementing feedback from field experiences
  • Report identified issues and field observations to the engineering team, providing clear documentation to support continuous improvement efforts
  • Test, troubleshoot and recommend improvements to advanced packaging assembly equipment
  • Identifies, analyzes and resolves system design weaknesses

Qualifications

  • Bachelors Degree preferred in Mechanical or Electrical Engineering, Physics or other fields related to semiconductor packaging;
  • 2+ years of experience in a related field; 
  • Knowledge of the semiconductor packaging is a plus;
  • Hands-on, strong aptitude and deep understanding of highly advanced machinery;
  • Experience with Advanced Packaging (flip chip, die attach or thermocompression bonding) or semiconductor manufacturing highly preferred;
  • Strong data analysis skills
  • Candidates with higher qualifications may be considered for a more senior position
  • Position to be located in Rio Rancho (New Mexico)

 

Kulicke & Soffa is an Equal Opportunity/Affirmative Action employer. All qualified applicants will receive consideration for employment without regard to race, color,  religion, sex, national origin, disability, sexual, gender identity or  protected veteran status.




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