FAE Assistant Manager

Job DetailsJob Location: Fort Worth, TX 76177Position Type: Full TimeEducation Level: 4 Year DegreeSalary Range: $75,000.00 - $85,000.00 Salary/yearJob Shift: DayJob Category: ManufacturingPosition Summary The Failure Analysis Engineering Department Assistant Manager will assist FAE manager in leading a multidisciplinary engineering team responsible for identifying, analyzing, and resolving failures in electronic systems, printed circuit assemblies, mechanical components, and integrated products across Wistron’s advanced manufacturing and repair operations. This position is instrumental in driving root cause analysis (RCA), corrective and preventive actions (CAPA), and continuous improvement across all product lines—including AI-enabled servers, NVIDIA GPU systems, and high-reliability industrial automation hardware. The ideal candidate brings deep expertise in electronics failure analysis and leadership in high-volume manufacturing environments, ensuring that customer quality, reliability, and turnaround requirements are consistently met and exceeded. Supervisory Responsibilities Direct supervision of 5–15 engineers and technicians. Approves evaluations, career development, and leads cross-functional quality and production teams. Key Responsibilities 1. Department Leadership and Strategy (25%) Lead the Failure Analysis Engineering Department, overseeing engineers, technicians, and support staff. Define the department’s strategic objectives aligned with Wistron’s global engineering and quality goals. Develop annual budgets, equipment plans, and staffing strategies to meet production and analysis demands. Champion a culture of technical excellence, continuous improvement, and accountability. Collaborate with R&D, Reliability, Production, and Quality Assurance teams to develop and implement FA processes. 2. Failure Analysis Operations Oversight (25%) Supervise day-to-day FA operations covering electrical, mechanical, and thermal failure analysis. Prioritize and assign failure analysis requests for returned units, line failures, and reliability test issues. Ensure the application of advanced analytical techniques including X-ray, SEM/EDS, decapsulation, cross-sectioning, micro-probing, and thermal imaging. Review and approve final FA reports for internal and customer use, ensuring clarity, technical accuracy, and actionable conclusions. 3. Root Cause and Corrective Action (20%) Lead high-visibility investigations on systemic or recurring failures affecting production yield or customer satisfaction. Oversee cross-functional teams performing RCA using structured problem-solving tools (8D, Ishikawa, FMEA, PDCA). Validate corrective actions and track the effectiveness of implemented solutions through measurable KPIs. Ensure lessons learned are systematically documented and shared across engineering, quality, and manufacturing functions. 4. Continuous Improvement and Technology Development (15%) Evaluate new diagnostic tools, techniques, and technologies to enhance FA capabilities. Partner with global Wistron R&D centers to drive Design for Reliability (DfR) and Design for Manufacturability (DfM) initiatives. Drive process improvements to reduce turnaround time, improve analysis precision, and increase customer satisfaction. Implement and monitor departmental Key Performance Indicators (KPIs) for efficiency, accuracy, and responsiveness. 5. People Management and Development (10%) Recruit, train, mentor, and evaluate engineers and technicians. Develop skill matrices and training programs to ensure technical proficiency across the team. Foster an environment that promotes collaboration, knowledge sharing, and continuous professional growth. Provide technical guidance on complex investigations and decision-making in escalated cases. 6. Compliance, Documentation, and Reporting (5%) Ensure compliance with ISO 9001, ISO 14001, and ESD standards in FA operations. Maintain up-to-date documentation, calibration records, and process control logs. Support audits and customer inspections related to FA, quality, or reliability assurance. Prepare executive-level reports summarizing department performance, trends, and risk assessments. QualificationsQualifications Education: Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or related field required. Master’s degree or Ph.D. in a related field preferred. Experience: Minimum 7–10 years of experience in failure analysis, reliability engineering, or product quality engineering within electronics or semiconductor industries. At least 3 years of leadership or management experience overseeing technical teams in manufacturing, OEM, or EMS environments. Experience with AI server hardware, GPU boards, motherboards, or high-density PCBs preferred. Technical Skills: Proficiency with diagnostic equipment (oscilloscope, DMM, logic analyzer, X-ray, SEM, FIB, etc.) Knowledge of SMT manufacturing, solder joint analysis, and IPC standards. Familiarity with reliability testing (HALT, HASS, thermal cycling, vibration testing). Experience with data analysis tools (Python, JMP, Minitab, Excel). Ability to interpret schematics, layout drawings, and bill of materials (BOM). Core Competencies Analytical Thinking: Strong ability to dissect complex problems and identify root causes. Technical Expertise: Deep understanding of electrical/electronic systems, PCB design, and semiconductor behavior. Collaboration: Works effectively with multidisciplinary teams to solve technical challenges. Communication: Ability to write clear, data-supported reports and present findings to technical and non-technical audiences. Continuous Improvement: Passion for enhancing product reliability and manufacturing efficiency Performance Indicators (KPI’s) Failure Analysis Turnaround Time (TAT) Root Cause Accuracy and Verification Rate Corrective Action Implementation Effectiveness Reduction in Recurrence Rate of Failures Customer Satisfaction (internal/external) with FA deliverables Working Conditions On-site role at Wistron’s Alliance, TX manufacturing facility. Exposure to electronics lab environments (ESD-safe areas, microscopes, soldering stations). Occasional travel to suppliers, customer sites, or corporate headquarters (domestic/international). Normal working hours with flexibility to support urgent FA cases and project deadlines.