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Boyd Thermal by Eaton - Firmware Engineer

Boyd
Posted 2 days ago, valid for 12 days
Location

Fredericksburg, VA, US

Salary

Competitive

Contract type

Full Time

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Sonic Summary

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  • Boyd's Thermal Test and Control Systems division in Phoenix, Arizona is seeking a Firmware Design Engineer responsible for full lifecycle development of custom thermal control application firmware.
  • The position requires a Bachelor’s degree in a related technical field and at least 10 years of relevant experience, including 4+ years in embedded system programming with C or C++.
  • Key responsibilities include developing thermal control products, supporting proof-of-concept studies, and maintaining firmware on existing thermal products.
  • Experience with communication methods like TCP/IP and low-level analog hardware interfacing is essential, along with the ability to understand schematics and IC operation.
  • The role offers a competitive salary, though specific figures were not disclosed in the job description.

Job Description


Firmware Engineer

Job Profile Summary

The Firmware Design Engineer is responsible for full lifecycle development of custom thermal control application firmware.

Job Description

 

Boyd’s Thermal Test and Control Systems division, located in Phoenix, Arizona, is developing innovative thermal test solutions for the semiconductor industry. The engineering team is seeking to grow our multi-disciplined engineering team to tackle new challenges in the industry and is seeking a talented Firmware Design Engineer to fill a critical role within the team. If you are a motivated and self-starting engineer interested in understanding entire systems and applying your understanding to turn concepts into great products, we are looking forward to you joining our team.

 

General Responsibilities

The Firmware Design Engineer will be a member of a multi-discipled engineering team to provide innovative thermal test solutions to the semiconductor industry.

The role will include:

• Working with multi-discipline team to develop thermal control products involving a diverse set of custom thermal forcing hardware

• Full lifecycle development of custom thermal control application firmware

• Supporting proof-of-concept studies

•  Using tuning parameters to effect dynamic performance of feedback control systems

• Maintenance and enhancement of firmware on existing thermal products

•  Firmware development using Qt/C++ for application development for Linux OS target and using C for non-OS/bare-metal target.

 

Experience / Qualifications

• Bachelor’s degree or higher in Electrical Engineering, Computer Engineering, Computer Science or related technical field and 10+ years of related experience.

• 4+ years experience in embedded system programming in C or C++

• Experience interfacing with common communication methods such as TCP/IP, and I2C,SPI,RS-232

• Experience interfacing with low-level analog hardware via ADC,DAC, and PWM

• Ability to understand schematics and IC operation and designing low-level drivers

 

Desired Skills:

• Multi-process/multi-threaded design experience

• Application programming experience on Linux-based platforms (Debian preferred)

• User Interface programming experience (Qt, WebIQ preferred)

• Configuring and tuning feedback control loops (e.g. PID)

• Windows desktop app development experience for utilities (C#/Visual Studio or Qt preferred)


All Job Posting Locations


Fredericksburg

Remote Type

On-Site

EEO Statement

Boyd Corp is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees.




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