Mechanical Engineer - HyperRF

OVERVIEW 

AV is seeking skilled Mechanical Engineers to support the design, analysis, and development of advanced RF and electromechanical systems within the Hyper-RF division. This role is critical to delivering robust, manufacturable, and high-performance products across a range of applications including radar, wireless communications, phased array systems, and embedded electronics. 

The ideal candidate brings deep expertise in mechanical design using SolidWorks, structural and thermal analysis using Ansys, and a strong working knowledge of product lifecycle management (PLM) processes within a disciplined engineering environment. This individual will work closely with cross-functional teams to transition designs from concept through production while ensuring compliance with quality and documentation standards. 

RESPONSIBILITIES 

• Lead the mechanical design and development of complex assemblies and enclosures for RF and electronic systems 

• Create detailed 3D models, drawings, and assemblies using SolidWorks 

• Perform and interpret structural, thermal, and vibration analyses using Ansys AEDT/Mechanical or Solidworks Simulation to validate designs against requirements 

• Collaborate with electrical, RF, FPGA, and software engineers to ensure seamless system integration 

• Drive designs from concept through prototype, qualification, and production 

• Develop and maintain complete technical data packages (TDPs), including drawings, BOMs, and analysis artifacts 

• Ensure designs meet environmental, performance, and manufacturability requirements 

• Support fabrication, integration, and test activities, including troubleshooting and root cause analysis 

• Participate in and lead design reviews (PDR, CDR, etc.) 

• Apply and enforce configuration management best practices, including revision control, change management (ECOs), and traceability 

• Work closely with manufacturing and supply chain teams to support production readiness and cost optimization 

• Mentor junior engineers and contribute to continuous improvement of engineering processes and standards 

• Identify, draft, and execute environmental test plans according to system level requirements 

REQUIRED QUALIFICATIONS 

• Bachelor’s degree in Mechanical Engineering or related field 

• 8+ years of relevant experience in mechanical design and analysis for complex systems 

• Expert-level proficiency with SolidWorks (part modeling, assemblies, drawings, and PDM integration) 

• Strong experience with Ansys for FEA structural analysis (stress, vibration, modal) and CFD thermal analysis (steady-state and transient) 

• Demonstrated experience designing for ruggedized electronics packaging, including thermal management and structural integrity 

• Experience with configuration management tools and processes (e.g., PDM/PLM systems, ECO workflows) 

• Strong understanding of GD&T, tolerance stack-ups, and design for manufacturability (DFM) 

• Experience supporting hardware through full lifecycle (design → build → test → production) 

• Ability to work in a fast-paced, multi-disciplinary team environment 

PREFERRED QUALIFICATIONS 

• Experience with RF systems, phased arrays, or high-frequency electronics packaging 

• Familiarity with passive and active thermal management techniques (heatsinks, fans, liquid cooling) 

• Experience designing for environmental compliance (shock, vibration, thermal cycling, EMI considerations) 

• Knowledge of materials selection for aerospace/defense applications 

• Experience with MIL-STD environmental and mechanical requirements 

• Familiarity with manufacturing processes (machining, sheet metal, additive manufacturing, injection molding) 

• Experience working in a regulated environment (e.g., ISO 9001, AS9100)