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Module Engineering Graduate Intern

Intel Corporation
Posted 2 days ago, valid for a month
Location

Hillsboro, OR, US

Salary

$89,098 - $89,102 per year

Contract type

Full Time

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Sonic Summary

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  • The Module Engineering Graduate Intern position involves contributing to the design and optimization of manufacturing engineering processes in a high-volume environment.
  • Candidates must be actively pursuing a Master’s Degree in a STEM field and preferably have prior hands-on experience in a semiconductor factory or high-tech manufacturing setting.
  • Key responsibilities include process optimization, troubleshooting, continuous improvement, and drafting standard operating procedures.
  • The annual salary range for this internship is between $89,098.00 and $89,102.00 USD.
  • This role requires an on-site presence in Hillsboro, Oregon.

Job Details:

Job Description: 

As a  Module Engineering Graduate Intern, you will contribute directly to the design, evaluation, and optimization of cutting-edge manufacturing engineering processes and factory operations. You will assist engineering teams in analyzing equipment performance, implementing root-cause corrective actions, and driving continuous process and yield improvements. 

This internship offers hands-on technical experience within a high-volume manufacturing environment. You will collaborate cross-functionally with operations, process engineering, and data teams to enhance production efficiency, product quality, and operational excellence while building foundational industry skills. 

Qualifications:

Responsibilities 

  • Process Optimization & Control: Monitor, maintain, and optimize daily module process performance, ensuring stability, high yield, and strict adherence to specifications. 

  • Troubleshooting & Root Cause Analysis: Investigate process excursions, equipment failures, and yield loss; execute root cause analysis (RCA) and implement robust corrective/preventative actions (CAPA). 

  • Continuous Improvement: Lead continuous improvement projects (CIP) utilizing Statistical Process Control (SPC), Design of Experiments (DOE), and Lean Six Sigma methodologies to reduce cost, shorten cycle times, and boost output. 

  • New Process Integration: Partner with R&D and Integration teams to qualify new equipment, transfer new technologies/recipes into high-volume manufacturing, and develop baseline standards. 

  • Standard Operating Procedures (SOPs): Draft, update, and maintain comprehensive engineering documentation, operating procedures, and safety protocols for module operations. 

Minimum Qualifications (MQ) 

  • Must be actively enrolled and pursuing a  Master’s Degree in a STEM field (e.g., Engineering, Physics, Materials Science, Computer Science, or related technical disciplines). 

Preferred Qualifications (PQ) 

  • Progressing towards a Ph.D. in a STEM field. 

  • Minimum cumulative GPA of 3.0 (preferred). 

  • Prior hands-on experience in a semiconductor factory/fab or high-tech manufacturing environment. 

  • Proficiency in software coding/scripting and advanced data analysis (e.g., Python, C++, MATLAB, Advanced Excel). 

  • Familiarity or practical experience with Artificial Intelligence (AI) / Machine Learning modeling. 

  • Hands-on experience with 3D modeling (CAD) and 3D printing/rapid prototyping. 

Note: Qualifications can be obtained through a combination of academic coursework, industry experience, research projects, or prior internships.

          

Job Type:

Student / Intern

Shift:

Shift 1 (United States of America)

Primary Location: 

US, Oregon, Hillsboro

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

 

 

Annual Salary Range for jobs which could be performed in the US: $89,098.00-89,102.00 USD

 

 

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Our standard internship rates are based on your degree, location, and the job role. Your recruiter can share more about the specific compensation range for your preferred location and job role during the hiring process.

 

 

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.



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