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Purpose of the position
Foxconn Technology Group, a global electronics manufacturing leader, seeks a Process Improvement Engineer to drive operational reliability and product quality by leading BGA rework equipment programming, maintenance protocols, and Control-run-managed process optimization. Responsibilities include standard operating procedure standardization, yield-driven problem resolution, client inquiry management, FACA analysis reporting, and PDCA-driven improvements to eliminate defects and boost repair efficiency.
Duties and Responsibilities
1. Dynamically adjust BGA rework equipment parameters based on product requirements to ensure precision, and validate equipment stability in real-time.
2. Perform BGA device cleaning, component inspections, and preventive maintenance, document anomalies, and drive rapid fixes to avoid downtime.
3. Design standardized workflows for diverse components and validate feasibility through hands-on testing.
4. Analyze Control-Run project yield data and bottlenecks, implement improvement plans, and align outputs with customer specifications.
5. Aggregate monthly PDCA results (e.g., efficiency gains, cost optimizations), analyze gaps, plan next steps, and communicate progress to clients to address technical queries, ensure compliance, and strengthen trust.
6. Adhere to company policies and  Standard Operating Procedures in all operational workflows.
Education and work experience
1.Successful completion of 4-years of high school, or equivalent, plus completion of 4 years of college with a bachelor’s degree, plus attainment of a master’s degree. Degree required: Electrical Automation Engineering
2. 3 to 8 years of experience in Automation, Mechanical Engineering, or Electronics sectors
Working conditions
1. Proficient in English is required; working knowledge of Mandarin is preferred but not required. Proficiency in Spanish is a plus.
2. End-to-end electronics manufacturing expertise with hands-on SMT assembly and wave soldering optimization to resolve production bottlenecks and drive process efficiency.
3. Proficiency in SMT IPC standards and PCB manufacturing processes to design quality-driven solutions, ensure compliance, and optimize production workflows.
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Foxconn Technology Group, a global electronics manufacturing leader, seeks a Process Improvement Engineer to drive operational reliability and product quality by leading BGA rework equipment programming, maintenance protocols, and Control-run-managed process optimization. Responsibilities include standard operating procedure standardization, yield-driven problem resolution, client inquiry management, FACA analysis reporting, and PDCA-driven improvements to eliminate defects and boost repair efficiency.
Duties and Responsibilities
1. Dynamically adjust BGA rework equipment parameters based on product requirements to ensure precision, and validate equipment stability in real-time.
2. Perform BGA device cleaning, component inspections, and preventive maintenance, document anomalies, and drive rapid fixes to avoid downtime.
3. Design standardized workflows for diverse components and validate feasibility through hands-on testing.
4. Analyze Control-Run project yield data and bottlenecks, implement improvement plans, and align outputs with customer specifications.
5. Aggregate monthly PDCA results (e.g., efficiency gains, cost optimizations), analyze gaps, plan next steps, and communicate progress to clients to address technical queries, ensure compliance, and strengthen trust.
6. Adhere to company policies and  Standard Operating Procedures in all operational workflows.
Education and work experience
1.Successful completion of 4-years of high school, or equivalent, plus completion of 4 years of college with a bachelor’s degree, plus attainment of a master’s degree. Degree required: Electrical Automation Engineering
2. 3 to 8 years of experience in Automation, Mechanical Engineering, or Electronics sectors
Working conditions
- Modern, collaborative offices or labs with flexible setups emphasizing innovation and teamwork.
- Employees are continuously encouraged to learn and grow their careers in smart manufacturing.
1. Proficient in English is required; working knowledge of Mandarin is preferred but not required. Proficiency in Spanish is a plus.
2. End-to-end electronics manufacturing expertise with hands-on SMT assembly and wave soldering optimization to resolve production bottlenecks and drive process efficiency.
3. Proficiency in SMT IPC standards and PCB manufacturing processes to design quality-driven solutions, ensure compliance, and optimize production workflows.
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