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Conduct design and development of image sensor technologies, work on transistor level design of analog and mixed-signal circuits for CMOS Image Sensor such as asic_pixel array, column-amplifier, comparator, ramp generator, ASRAM and XDEC by using Cadence Virtuoso; Work on whole chip floorplan design and pad frame; Work on analog and mixed signal circuits layout design by Cadence Virtuoso, such as column_array; Collaborate with layout engineer on whole chip layout integration and improvement by Cadence Virtuoso; Perform sub-blocks and whole image sensor readout circuit simulation by simulators such as Analog FastSPICE (AFS), Empyrean ALPS and NanoSpice; Perform design verification such as DRC, LVS, PERC check by using Siemens Calibre; Perform whole chip IR drop check by using Ansys Totem; Conduct script modification using Perl programming language; Collaborate with Digital Engineer to define and design the analog to digital interface; Collaborate with verification, process, test, and application engineers to debug, characterize and optimize performance of fabricated image sensors; Analyze project-specific specifications, such as speed, linearity, noise, power consumption, etc, and improve circuit designs or implement innovative solutions to meet performance requirements; Define corners based on chip operating conditions, ensuring the chip meets specifications and operates reliably with sufficient margin for robustness under all conditions; Propose innovative and creative solutions along with new circuit R&D and be ahead of current technology.
Requirements:
Master’s degree or foreign equivalent degree in Electrical Engineering, Computer Engineering, or related fields. Require coursework in Analog Integrated Circuit and Power Electronics Design.
Require knowledge or skills of:
•   Analyze analog and mixed-signal circuits; troubleshoot and resolve circuit issues;
•   Design analog/mixed-signal circuits based on specifications; optimize for higher performance;
•   Perform circuit simulations using tools such as Cadence Spectre or HSPICE;
•   Understand layout impact on circuit performance; apply layout strategies to minimize adverse effects;
•   Knowledge of semiconductor device physics and its influence on circuit behavior;
•   Analyze and mitigate thermal, flicker, and shot noise in analog designs;
•   Knowledge of integrated circuit fabrication processes and incorporating process variation considerations into schematic and layout design.
•   Design and analyze power management circuits, including LDOs and charge pumps.
•   Design analog/mixed-signal circuits based on specifications; optimize for higher performance;
•   Perform circuit simulations using tools such as Cadence Spectre or HSPICE;
•   Understand layout impact on circuit performance; apply layout strategies to minimize adverse effects;
•   Knowledge of semiconductor device physics and its influence on circuit behavior;
•   Analyze and mitigate thermal, flicker, and shot noise in analog designs;
•   Knowledge of integrated circuit fabrication processes and incorporating process variation considerations into schematic and layout design.
•   Design and analyze power management circuits, including LDOs and charge pumps.
Annual base salary for this role in California, US is expected to be between $125,000 - $135,000. Actual pay will be determined on a number of factors such as relevant skills and experience, and the pay of employees in the similar role.
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