We are looking for a Camera and Depth Systems Engineer to drive the development, industrialization, and continuous improvement of optical sensing modules, including camera, depth and ALS modules, for high-volume consumer products. You will partner with internal cross-functional teams and external suppliers to deliver robust module designs, enable scalable assembly processes, and contribute to innovation in optical sensing module architectures.

Responsibilities

Own system-level technical execution for optical sensing modules (camera and/or depth), from concept through mass production
Define and refine module requirements and specifications, including optical, mechanical, electrical, thermal, reliability, and manufacturing constraints
Drive module assembly and packaging development, including tolerance stack-up, process windows, manufacturability (DFM/DFA), and yield improvement
Collaborate with EE/firmware/system teams on electrical interface definitions, bring-up support, and module-level debugging/troubleshooting
Lead cross-functional investigations for factory yield issues, field returns, and reliability failures; coordinate FA, corrective actions, and prevention plans
Analyze production/test data to identify trends, quantify risks, and prioritize improvement opportunities; communicate results to technical and non-technical stakeholders
Engage with suppliers and CM partners to review process capability, qualification plans, control plans, and validation data
Contribute to optical sensing module innovation (new packaging approaches, architectures, materials, test strategies, and manufacturing methods)
Travel to vendor/manufacturing sites as needed to support builds, issue resolution, and production readiness

Minimum Qualifications

BS/MS in Optical Engineering, Mechanical Engineering, Electrical Engineering, Physics, or a related field
2+ years of industry experience in optical sensing modules (e.g., camera modules, depth modules, ToF, structured light, stereo, active illumination systems) for consumer electronics or similar high-volume products
Familiarity with typical camera/depth module assembly flows (alignment, bonding/adhesives, curing, cleanliness/contamination control, calibration/test, rework considerations)
Knowledge of module packaging technologies and manufacturing methods (examples: active/passive alignment, wafer-level optics (WLO), lens barrel/holder assemblies, cover glass integration, OIS/actuator integration where applicable)
Understanding of electrical interfaces and module integration basics (connectors/FPC, signal integrity considerations at a practical level, ESD handling, power/grounding basics, module-level debug support)
Demonstrated experience with using data to drive decisions (yield, parametric trends, reliability data, test limits, Cp/Cpk/SPC concepts)
Experience in cross-functional communication and experience in leading technical discussions with internal teams and external vendors
Willingness to travel domestically/internationally (typically up to ~10%)

Preferred Qualifications

Experience taking an optical module from early development through ramp and sustaining in mass production
Depth sensing experience with active illumination (VCSEL/LED), diffractive optical elements (DOE), optical filters, and system calibration approaches
Experience with FA methods and tools relevant to optical modules (e.g., decap/physical inspection, metrology, optical inspection, adhesive/contamination analysis, environmental/reliability stress correlation)
Familiarity with high-volume test strategies for optical modules (end-of-line test, calibration flows, guardbanding, measurement system analysis)
Supplier management experience (process audits, PPAP-like qualification thinking, control plans, change control/PCN handling)

$118,000/year to $170,000/year + bonus + equity + benefits

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