SonicJobs Logo
Left arrow iconBack to search

Manufacturing Technical Program Manager

AttoTude
Posted 3 months ago, valid for 8 days
Location

Menlo Park, CA 94025, US

Salary

$78.13 - $93.75 per hour

Contract type

Full Time

By applying, a AttoTude account will be created for you. AttoTude's Privacy Policy and Terms & Conditions will apply.

SonicJobs' Terms & Conditions and Privacy Policy also apply.

Sonic Summary

info
  • AttoTude is seeking a Manufacturing Technical Program Manager (MFG TPM) to lead the development and execution of advanced manufacturing technologies in their innovative data center solutions.
  • The ideal candidate should have a Bachelor's degree in Engineering or a related field, with a Master's preferred, and at least 8 years of experience in technology development, wafer fabrication, or advanced manufacturing NPI.
  • This role requires proven experience in leading wafer-level or semiconductor-based products through production ramp and managing complex technical programs across multiple teams and sites.
  • Key responsibilities include overseeing end-to-end technical execution of NPI programs, driving concurrent development with R&D, and ensuring alignment across manufacturing partners.
  • AttoTude offers a competitive salary, and they are committed to diversity and inclusion in the workplace.

About AttoTude, The World's First THz Radio Over Wire 

AttoTude is at the forefront of revolutionizing data centers through advanced interconnect technology based on wired THz transceivers. By adapting the fiber from photonics and advancing today's ASICs to THz, our innovative AttoEngine eliminates networking bottlenecks, enabling high-speed interconnects for AI data centers. 

Job Summary 

The Manufacturing Technical Program Manager (MFG TPM) leads the development, industrialization, and execution of advanced manufacturing technologies spanning wafer fabrication, innovative wire solutions, and precision alignment/assembly processes. The role owns technical program strategy, readiness milestones, and execution cadence to mature new technologies from early development through high-volume production. 

Serving as a technical bridge across R&D, wafer fabs, OSATs, Manufacturing Engineering, and CMs, the MFG TPM ensures alignment between design intent, process capability, yield, and manufacturing readiness across globally distributed teams. The role combines strong wafer-fab technical understanding with disciplined program leadership and hands-on problem solving to support advanced datacenter hardware platforms. 

Key Responsibilities 

  • Own end-to-end technical execution of NPI programs from technology development through production ramp. 
  • Drive concurrent development with R&D, aligning device architecture, process flows, and manufacturing strategy. 
  • Lead wafer fabrication industrialization, including lithography, deposition, etch, CMP, metrology, and yield ramp. 
  • Define and manage technology readiness milestones, build gates, and technical risk mitigation. 
  • Act as the primary technical integrator and escalation point across fabs, OSATs, Manufacturing Engineering, and CMs. 
  • Transition technologies from pilot builds into high-volume fab and manufacturing environments. 
  • Establish yield learning, SPC, and control strategies and lead root cause resolution for process and reliability issues. 
  • Own technical change control and ensure clear, consistent communication across sites and partners. 

 

Required Qualifications 

  • Bachelor’s degree in Engineering or related discipline (Master’s preferred). 
  • 8+ years of experience in technology development, wafer fabrication, or advanced manufacturing NPI. 
  • Proven experience leading wafer-level or semiconductor-based products through production ramp. 
  • Ability to manage complex technical programs across multiple teams, sites, and manufacturing partners. 
  • Experience working directly with wafer fabs, OSATs, and external manufacturing partners. 

Preferred Qualifications 

  • Hands-on experience with silicon wafer fab processes (lithography, etch, deposition, CMP, metrology). 
  • Experience with advanced packaging or interposers. 
  • Familiarity with high-performance interconnects (wires, cables, connectors). 
  • Experience supporting datacenter, HPC, or performance-critical hardware. 

Key Competencies 

  • Technology development and industrialization 
  • Wafer fab and process integration 
  • Technical program ownership 
  • Cross-functional and cross-site communication 
  • Yield, reliability, and manufacturability optimization 

AttoTude is an equal opportunity employer. We’re committed to building a diverse and inclusive workplace and providing equal employment opportunities to all applicants and employees. We do not discriminate on the basis of race, color, religion, sex, sexual orientation, gender identity or expression, national origin, age, disability, veteran status, or any other legally protected characteristic.

 




Learn more about this Employer on their Career Site

Apply now in a few quick clicks

By applying, a AttoTude account will be created for you. AttoTude's Privacy Policy and Terms & Conditions will apply.

SonicJobs' Terms & Conditions and Privacy Policy also apply.