Plating and Wet Etch Manufacturing Engineer (50735)

Job DetailsJob Location: Milipitas, CA 95035Position Type: Full TimeEducation Level: Graduate DegreeSalary Range: $121,000.00 - $160,000.00 Salary/yearJob Shift: DaysTITLE:                        PLATING AND WET ETCH MANUFACTURING ENGINEER FLSA STATUS:          EXEMPT REPORTS TO:          SR. MANAGER, PLATING MANUFACTURING ENGINEERING SUMMARY: Under the direction of the Senior Manager, Plating Manufacturing Engineering, the Plating and Wet Etch Manufacturing Engineer is responsible for the monitoring, sustaining, and supporting day-to-day plating processes and programs on the manufacturing line, including developing and delivering strategies to improve and optimize processes in electroplating, resist stripping, and wet etching;  developing and implementing practices or methodologies which reduce cost and improve operational efficiency; analyzing data, creating reports, and making presentations to groups; conducting root cause analysis and implementing corrective action; developing and implementing procedures for transitioning new products in the manufacturing line; and reviewing, updating, and maintaining all documentation and MPI’s. This position is located in Milpitas, California. ESSENTIAL FUNCTIONS: Monitors, sustains, and supports day-to-day plating, stripping, wet etch manufacturing processes, programs, and activities in the electroplating, resist stripping, and wet etching areas Ensures process reliability by providing technical support to operators, technicians, and other engineers Collaborates with development team regarding new plating, stripping, wet etch process integration and manufacturing process improvements; may act as project lead on more complicated integration or optimization initiatives Improves the efficiency of the plating, stripping, wet etch process by analyzing data, conducting experiments, and researching alternative methods which reduce scrap Designs and conducts advanced experiments to verify process robustness; analyzes data and reports findings Develops and implements practices or methodologies which lower cost, increase yield, and improve operational efficiency Conducts root cause analysis and implements corrective action if required Researches and proposes methods for improving production yields via process/tool manufacturability optimization Responds to inquiries from other team members, managers, or departments Uses Statistical Process Control (SPC) to analyze product quality data; develops charts or reports and presents findings before groups or teams Adheres to all safety policies and procedures as required Performs other duties of a similar nature or level* sMINIMUM QUALIFICATIONS: Master’s degree in Chemistry, Chemical or Electrical Engineering, Materials Science, or Physics and/or equivalent relevant experience; PhD degree preferred Three years of hands-on experience working in the magnetic thin film fabrication or semiconductor industries in a manufacturing or process engineering role Strong experience using semiconductor device testing, including I-V, C-V, M-H Hysteresis, and Magnetoresistivity Hands’ on experience in SPC and Design of Experiments (DOE) Proficient in the use of Microsoft Office Applications Knowledge, Skills, and Abilities: Knowledge of plating techniques, including resist stripping, wet etching, and electroplating Knowledge and experience using JMP or Excel and the ability to create macro formulas Knowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations Able to design experiments, analyze results, and recommend corrective action Able to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management Able to work productively and collaboratively with all levels of employees and management Able to comply with all safety policies and procedures Able to use critical thinking to resolve issues, conduct root cause analysis, and make recommendations for process improvements Demonstrated critical thinking and analytical skills Demonstrated organizational and time management skills Demonstrated problem-solving and trouble shooting skills Flexible and able to prioritize The annual rate for this full-time position is between $121,000.00-160,000.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual pay range shown is subject to change and may be modified periodically. WORKING CONDITIONS: The Plating and Wet Etch Manufacturing Engineer works primarily in an office environment from Monday thru Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from building-to-building as needed. Works in a class 100 ESD sensitive wafer manufacturing facility; wears a cleanroom (bunny) suit, including hood, gloves, safety glasses, booties, and mask.  May be exposed to hazardous conditions, chemicals, fumes, and/or gases during the course of work day; may be exposed to loud noise. Stands, walks, bends, and twists. Performs various fine grasping movements; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment; may occasionally be required to push, pull, or lift up to 30 pounds. *Other duties of a similar nature or level are duties that may be required, but may not be specifically listed in the job description or posting. TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics.  Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department.