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IC Package Design Engineer

Apple
Posted 3 days ago, valid for 24 days
Location

Monte Sereno, CA 95030, US

Salary

Competitive

Contract type

Full Time

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Sonic Summary

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  • Apple's Packaging team is seeking a Package Design Engineer to develop advanced semiconductor packaging solutions for various products, including iPhone and Mac.
  • The role involves leading package architecture and design, optimizing configurations, and collaborating with cross-functional teams to enhance performance.
  • Candidates should have a Bachelor's degree and at least 5 years of experience in IC package physical design using platforms like Cadence Allegro or Mentor Xpedition.
  • Expertise in high-speed interface layout, Signal/Power Integrity analysis, and knowledge of manufacturing processes is essential for this position.
  • The salary for this role is competitive, commensurate with experience, and candidates should be familiar with automation and scripting in a Unix/Linux environment.
Our Packaging team defines, designs, and integrates advanced electronic packaging solutions for Apple’s internal and custom components across products including iPhone, iPad, Mac, Apple Watch, and Apple TV. We’re looking for a Package Design Engineer to drive the physical design and integration of advanced semiconductor packages across SoC, memory, RF, and cellular technologies. You will play a key role in shaping the architecture, scalability, and efficiency of next-generation products while advancing design methodologies through automation and AI.

Description


As a Package design engineer, you will lead advanced package architecture, drive next-generation package structure and configuration optimization, and own Package/SiP/module physical design from concept through tape-out. You will collaborate closely with cross-functional teams to deliver optimized SI/PI performance across a wide range of silicon technologies You are expected to leverage AI tools to enhance design efficiency, quality and performance.

Minimum Qualifications


Bachelors degree required.

Preferred Qualifications


Package Design Proficiency: Proven experience in IC package physical design using Cadence Allegro or Mentor Xpedition platforms, with knowledge of diverse package types (SiP, PoP, wirebond) and verification tools (Calibre, CAM350). High-Speed & SI/PI Expertise: Strong understanding of high-speed interface layout constraints (DDR, PCIe) and Signal/Power Integrity (SI/PI) analysis, including experience with simulation tools like HFSS or PowerSI and parasitic extraction (RLGC, S-parameters). Manufacturing & Materials Knowledge: Solid grasp of substrate manufacturing processes, design rules (DRC), design for manufacturability (DFM), and various sophisticated package configurations and assembly technology Automation & Scripting Skills: Familiarity with a Unix/Linux environment and proficiency in scripting languages such as Python, Perl, or TCL to automate design tasks and improve workflows.


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