IC Package Design Researcher

Nokia

Posted 25 days ago, valid for 15 days

New Providence, NJ 07974, US

$80,000 - $96,000 per year

Full Time

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Sonic Summary

The role involves developing next-generation packaging solutions through the identification, integration, and validation of new materials.
It requires collaboration across multiple teams, including RF/EM, mechanical/thermal, optical integration, reliability, supplier, and manufacturing.
Candidates should possess a solid background in materials science and packaging, along with practical process experience.
A data-driven approach to reliability-by-design is essential for success in this position.
The job typically requires several years of relevant experience and offers a competitive salary in line with industry standards.

You will realize next-generation packaging solutions by identifying, integrating, and validating novel materials. It is a highly cross-functional role, engaging RF/EM, mechanical/thermal, optical integration, reliability, supplier, and manufacturing teams. The ideal candidate brings a strong materials science and packaging background, hands-on process know-how, and a data-driven approach to reliability-by-design.

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