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Lead Laser Component Reliability Engineer

IPG Photonics
Posted 2 months ago, valid for 2 days
Location

Oxford, MA 01540, US

Salary

Competitive

Contract type

Full Time

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Sonic Summary

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  • IPG Photonics, a leader in fiber lasers and amplifiers, is seeking a Laser Component Reliability Engineer with a Master's degree and 3-6+ years of relevant experience or a PhD with 3+ years in Reliability Engineering, Electrical Engineering, Physics, or Materials Science.
  • The role involves reliability analysis and qualification of fiber-coupled multi-emitter pump modules and semiconductor laser diodes, focusing on accelerated life testing and statistical lifetime modeling.
  • Candidates should possess a strong background in reliability engineering for optoelectronic devices, advanced statistical methods, and experience with design of experiments.
  • The position offers a motivating work environment, challenging projects, and competitive benefits, reflecting the company's commitment to a thriving workforce.
  • Salary details are not specified, but the role requires significant expertise in reliability data analysis and cross-functional communication.
IPG Photonics is revolutionizing the laser industry as the pioneering developer and leading producer of fiber lasers and amplifiers. Headquartered in Marlborough, MA, IPG has over 4,800 employees in more than 30 locations around the world. We aspire to work together with our employees and customers to apply light in ways that improve life.

 

Our mission is to develop innovative laser solutions to make the world a better place. To accomplish this mission, we are committed to attracting and retaining the best talent and an engaged and thriving workforce that drives a sustainable future for our company and society.

 

Working at IPG Photonics you can expect challenging projects, a motivating and friendly environment, and competitive benefits.

 

We are seeking a highly skilled Lead Laser Component Reliability Engineer to drive reliability analysis and qualification of fiber-coupled multi-emitter pump modules and semiconductor laser diodes. The ideal candidate will have a deep understanding of failure mechanisms in fiber-coupled multi-emitter pump modules and their critical components and interfaces, combined with strong expertise in reliability engineering, advanced statistics, and design of experiments. The role will focus on accelerated life testing, degradation analysis, statistical lifetime modeling, and reliability risk assessment to support product qualification.


Key Responsibilities:

  • Develop, design, and execute reliability test plans for fiber-coupled multi-emitter pump modules and semiconductor laser diodes
  • Conduct and analyze accelerated lifetime, burn-in, stress, and qualification testing
  • Apply statistical methods to evaluate lifetime, degradation, failure rates, and confidence intervals
  • Identify key reliability drivers and sensitivities in design and processes
  • Investigate failure mechanisms and perform root-cause analysis of device degradation
  • Prepare clear reliability reports and data-driven technical recommendations
Qualifications

Required Qualifications: 

  • Master’s degree with 3-6+ years of relevant experience, or PhD with 3+ years of industrial experience, in one of the following fields (Reliability Engineering, Electrical Engineering, Physics or Materials Science)
  • Strong background in reliability engineering for optoelectronic devices, semiconductor devices, photonic components, or laser diodes
  • Deep understanding of statistics and lifetime data analysis, including Weibull modeling, Kaplan–Meier methods, log-normal modeling, probability distributions, confidence intervals, hypothesis testing, and uncertainty analysis, etc.
  • Strong experience with design of experiments and statistical test planning
  • Experience with accelerated life testing and degradation modeling
  • Ability to analyze reliability data using tools such as Python, R, or equivalent statistical software

Preferred Qualifications:

  • Knowledge of optoelectronic packaging and material/interface reliability 
  • Experience with failure analysis techniques (SEM, FIB, EDX, microscopy)
  • Ability to work cross-functionally and communicate complex technical results

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