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EnaChip: Electrical Design Engineer

Anzu Partners
Posted a month ago, valid for 15 days
Location

Philadelphia, Philadelphia, PA

Salary

$90,000 - $115,000 per year

Contract type

Full Time

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Sonic Summary

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  • EnaChip is seeking an Electrical Design Engineer in Philadelphia, PA, to optimize and own the electroplating process for power delivery systems.
  • The position requires a Bachelor's degree in a related field and 3-5 years of experience in electroplating or electrochemical deposition within semiconductor manufacturing.
  • Key responsibilities include developing electroplating processes, improving yield, and collaborating with design teams on material properties.
  • The base salary for this role ranges from $90,000 to $115,000, depending on experience and qualifications, with total compensation including equity.
  • EnaChip is committed to diversity and inclusion, ensuring equal opportunity for all applicants.



Electrical Design Engineer

Philadelphia, PA

About EnaChip

EnaChip is building a new foundation for power delivery—bringing together advances in materials science, semiconductor processing, and system architecture. Our mission is to remove power delivery as a constraint on technological progress, enabling the next generation of compute systems to reach higher performance, efficiency, and scale.

The Opportunity

EnaChip is looking for an Electroplating Engineer who wants to define, optimize, and own the electroplating process. This is an opportunity to scale a process from R&D to wafer- and panel-level production, working at the leading edge of a platform that's bringing magnetics directly into the semiconductor stack. You'll join a young, growing team, with real opportunities to move into a leadership role as the company scales. This position will work onsite in Philadelphia.

Key Responsibilities

  • Develop and optimize electroplating processes for magnetic alloy deposition
  • Characterize processes, improve yield, and integrate electroplating with semiconductor fabrication flows
  • Scale electroplating processes from R&D to wafer- and panel-level production
  • Collaborate with materials and design teams to tune conductor and magnetic layer properties

Qualifications

  • Bachelor's degree in Materials Science, Chemical Engineering, Electrical Engineering, or related field
  • 3-5 years of experience with electroplating/electrochemical deposition in a semiconductor or advanced manufacturing environment
  • Experience with multiple power supply types, bath metrology/monitoring equipment, SPC/DOE and related software (JMP), and thin-film characterization
  • Knowledge of plating bath chemistry, current density optimization, and thin-film characterization
  • A strong process-ownership mindset — you define it, you build it, you scale it

Nice to Have

  • Experience in a startup or early-stage hardware environment
  • Base salary range: $90,000–$115,000, commensurate with experience and qualifications
  • Total compensation includes equity in a rapidly growing start-up

Compensation

EnaChip is an Equal Opportunity Employer. We celebrate diversity and are committed to creating an inclusive environment for all employees. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, veteran status, or any other legally protected characteristic.




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