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Job Description
Assembly and Test Technology Development (ATTD) Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.
Key Responsibilities
Prioritize and organize daily activities around multiple requests for engineering DOEs, pre-ops meeting preparation, documentation and AR tracking, and quick and effective response to production issues.
Be experts in all tools and processes in the area to support elaborate DOEs and NPIs.
Be able to coach and role model the correct execution of module operations.
Clearly understand and communicate execution issues, quality excursions, and equipment problems to Engineering and Manufacturing teams.
Apply correctly and effectively the POR tools and methods to contain, mitigate and solve issues, including: XTREAMs and Spec RFCs, Wiki / Documented BKMs / MITTS records / Tool error and troubleshooting message, 5M+E checklists, Tool log files / SC logs / SPC++ / E3 / ATRMS / Feedback files, MBPS (is/is-not, models, validation data). Escalations or pass down must include full documentation of steps and results obtained to that point, plus any next steps or recommendations.
Ensure all Out-of-Control events have been annotated, reviewed and issues communicated for resolution
First point of contact for Manufacturing.
Spend more than 3/4 of your time on the floor.
Disposition/release un-scheduled hold lots within 10 hours and scheduled hold lots within 24 hours.
Support Manufacturing on resolving any product recipe or parameter issues.
Keep all Operation and Recipe Creation specs up to date.
Initiate the investigation and documentation of quality excursions for the area, in partnership with Manufacturing and Factory Quality teams. Assume initial ownership where RC is not evident.
Prepare and execute New Product Introductions, including evaluation of recipe needs, collateral ordering, and recipe creation.
Understand and ensure all data is collected on critical lots.
Consolidate and prioritize area improvement projects with Manufacturing
Support Working Group and Task Force activities, executing experiments and providing engineering data.
Support MTEs on resolving any equipment issue.
Complete clear pass downs for issues seen and resolutions found.
Support early processing of lots through new operations, then provide training, certification and final endorsement to Manufacturing.
The candidate should exhibit the following behavioral traits:
Strong technical problem-solving abilities with the ability to analyze and implement solutions in a dynamic operations environment.
Demonstrated ability to collaborate with cross-functional teams and prioritize multiple activities effectively.
Qualifications
Minimum Qualifications:
Bachelor’s degree in Mechanical Engineering, Chemical Engineering, Electrical Engineering, Materials Science, or a related field with 2+ years of relevant experience.
Master’s degree in Mechanical Engineering, Chemical Engineering, Electrical Engineering, Materials Science, or a related field with 6+ months of relevant experience.
Experience listed above should be in any the following:
Semiconductor Equipment Development and/or Manufacturing
Semiconductor Product Development and/or Manufacturing
High Volume Technology Manufacturing
Automated Manufacturing
This position is not eligible for Intel Immigration Sponsorship
Preferred Qualifications:
- High Volume Manufacturing experience is a plus.
- Engineering experience in Semiconductor Fab or Package Assembly is a plus.
We invite you to bring your expertise, creativity, and passion for innovation to Intel, where you can make a meaningful impact on the future of technology. Apply today to join our team and help drive Intel's success in delivering world-class packaging solutions.
Inside this Business Group
Intel makes possible the most amazing experiences of the future. You may know us for our processors. But we do so much more. Intel invents at the boundaries of technology to make amazing experiences possible for business and society, and for every person on Earth. Harnessing the capability of the cloud, the ubiquity of the Internet of Things, the latest advances in memory and programmable solutions, and the promise of always-on 5G connectivity, Intel is disrupting industries and solving global challenges. Leading on policy, diversity, inclusion, education and sustainability, we create value for our stockholders, customers, and society.
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
Annual Salary Range for jobs which could be performed in the US $94,300.00-$133,200.00
*Salary range dependent on a number of factors including location and experience
Working Model
This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.
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