Job Description

Join Intel's Advanced Packaging Technology Development team as a Packaging Module Development Engineer. In this pivotal role you will develop and optimize cutting-edge substrate processes and equipment to enable Intel's future packaging platform technologies. Your contributions will directly impact the manufacturability and reliability of next-generation products, addressing quality, cost, yield, and productivity requirements. Collaborate with cross-functional teams to tackle complex challenges, push boundaries, and innovate within a dynamic, fast-paced environment.
The scope of this role include:

- Process equipment design, install, and qualification
- Technology pathfinding and development of multi metal plating module focusing on surface prep processes, electroless and electrolytic plating.
- The engineer will join / become part of a world class first of a kind embedded die packaging facility, learn advanced substrate manufacturing know-how, drive disruptive technology innovations, and be part of creating history in the substrate packaging industry.

Other responsibilities include but are not limited to:

- Define and establish equipment configurations, process specifications, and integrated process flow for new process technologies
- Plan and conduct comprehensive DOEs to fundamentally characterize process window, and understand process / equipment / materials / chemistry interactions
- Drive continuous process improvements on process capability/stability, quality/reliability, cost/yield, automation, and productivity
- Lead and participate in cross-functional and cross-organizational teams or work groups that support substrate technology development.

The ideal candidate should exhibit the following behavioral traits:

- Proven technical leadership skills: Self initiative, leadership, action-oriented by influencing, written and verbal communication skills with the ability to work independently.
- Demonstrated ability to successfully participate in a highly matrix environment managing resources and timelines, as well as proven stakeholder management.
- Flexibility in changing priorities and responsibilities to support business needs.
- Work with ambiguity in a fast paced, constantly changing product roadmap environment.

Qualifications

You must possess the below requirements to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates Knowledge and/or experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences

Minimum requirements:

Candidate must possess a Bachelor’s degree in in Materials Science and Engineering, Chemical Engineering, Chemistry, Polymer Engineering, Mechanical Engineering, Construction Management; or related engineering degree plus 2+ years of experience.
Master's degree in Materials Science and Engineering, Chemical Engineering, Chemistry, Polymer Engineering, Mechanical Engineering, Construction Management; or related engineering degree.

Experience listed above should a combination of the following:

Packaging module development experience
Experience in process equipment design, install, and qualification
Experience defining and establishing equipment configurations, process specifications, and integrated process flow for new process technologies

Preferred qualifications:

Plating chemistry and Electrochemistry fundamental knowledge are a plus.
PhD degree in in Materials Science and Engineering, Chemical Engineering, Chemistry, Polymer Engineering, Mechanical Engineering, or related engineering degree.
Plan and conduct comprehensive DOEs to fundamentally characterize process window, and understand process / equipment / materials / chemistry interactions
Drive continuous process improvements on process capability/stability, quality/reliability, cost/yield, automation, and productivity

Inside this Business Group

Intel makes possible the most amazing experiences of the future. You may know us for our processors. But we do so much more. Intel invents at the boundaries of technology to make amazing experiences possible for business and society, and for every person on Earth. Harnessing the capability of the cloud, the ubiquity of the Internet of Things, the latest advances in memory and programmable solutions, and the promise of always-on 5G connectivity, Intel is disrupting industries and solving global challenges. Leading on policy, diversity, inclusion, education and sustainability, we create value for our stockholders, customers, and society.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.

Annual Salary Range for jobs which could be performed in the US $109,600.00-$154,800.00
*Salary range dependent on a number of factors including location and experience

Working Model

This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.

Learn more about this Employer on their Career Site

Packaging module development engineer