Job Description

Join Intel's Advanced Packaging Team as part of the Substrate Packaging Technology Development (SPTD) organization.
Our mission is to be the supplier of choice for leading-edge, high quality, and cost effective substrate packaging solutions. Become part of SPTD to help us advance this mission while contributing to an exceptional workplace culture.

Role Overview:

Yield Engineer On Shift (YEOS): As a YEOS engineer, you will provide critical factory support by addressing equipment, process, and product issues in real time to enable uninterrupted 24x7 lot movement through the manufacturing line. You will respond to process deviations, perform error recovery, manage lot dispositions, support new tool enabling, and handle a variety of ad hoc tasks within your functional area.

Key Responsibilities (include but are not limited to):

Receive written and verbal passdown from tool owners and previous shift peers. Execute tasks based on shift priorities and escalate issues following the calling tree when roadblocks arise.
Perform key shift activities such as tool troubleshooting, recipe modifications, PIL reviews and approvals, executing non standard procedures (e.g., visual inspections, engineering scans and basic analysis), and other factory required tasks.
Write and update specifications and RFCs after reviews with tool owners and internal stakeholders including defect reduction teams.
Provide thorough written and verbal passdown to the incoming shift, ensuring clear, structured communication of activities, encountered issues, and detailed observations that support effective resolution.

The ideal candidate will demonstrate the following behavioral traits:

Strong problem solving and troubleshooting skills.
Effective verbal and written communication skills, with a willingness to collaborate closely with peers, engineers, and customers.
Flexibility to support night and weekend shifts over extended periods.
Skills to learn quickly and efficiently handle new tasks.
Capability to work with minimal supervision and adapt to rapidly changing priorities.
Self driven mindset with the skills to manage individual responsibilities while contributing to team objectives.
Strong documentation skills, including careful analysis of observations and well reasoned conclusions.

Qualifications

Minimum Requirements:

Bachelor's degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related discipline with 1+ years of relevant experience. OR
Master's degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related discipline.
Experience with defect metrology or yield tool sustenance, RFC setup, and SPC.

Preferred Qualifications:

1+ years of experience in semiconductor packaging or substrate manufacturing.
Prior experience working night and weekend shifts.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.

Annual Salary Range for jobs which could be performed in the US $81,100.00-$114,600.00
*Salary range dependent on a number of factors including location and experience

Working Model

This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.

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