Microelectronics Packaging Design Engineer Jobs in Scottsdale, AZ

Mechanical Tooling Engineer

$133,800 - $255,200 per year

Intel Corporation

Job Details: Job Description:  Who we are: The Advanced Packaging Technology and Manufacturing (APTM) organization is...

Phoenix

7 days ago

Staff, Semiconductor System Level Simulation Engineer

Competitive

onsemi

ON Semiconductor is seeking a self-driven and motivated professional to join their Corporate R & D modeling and simulati...

Scottsdale

14 days ago

Sr. CPU RTL Front End Methodology Engineer

$164,470 - $311,890 per year

Intel Corporation

Job Details: Job Description:  Intel is shaping the future of technology to help create a better future for the entire...

Phoenix

8 days ago

Intel Process Integration Engineer - (BE)

$116,100 - $163,800 per year

INTEL

Job Description Join Intel and build a better tomorrow. What we do: The Intel Foundry MDCE and Logic Technology develop...

Phoenix

9 days ago

SiC Wafer and Package Technology Development Engineer

Competitive

onsemi

Technical and customer support for the qualification of SiC die sales and development SiC wafer die sales is a main focu...

Scottsdale

15 days ago

Packaging Module Development Engineer

$115,110 - $219,550 per year

Intel Corporation

Job Details: Job Description:  The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible...

Phoenix

16 days ago

Staff Package Design Engineer

Competitive

Renesas Electronics

Company Description Renesas is a global leader in microcontrollers, analog, power, and SoC products, delivering semicond...

Tempe

13 days ago

ADCE Packaging Design Architect

$220,920 - $311,890 per year

Intel Corporation

Job Details: Job Description:  Drives end-to-end development for substrate design from concept through tape out and im...

Phoenix

16 days ago

Collateral Design and DFM Engineer

$190,650 - $269,150 per year

Intel Corporation

Job Details: Job Description:  About MDCE  Manufacturing Development and Customer Engineering (MDCE) is Intel's newest...

Phoenix

15 days ago

Packaging Module Development Engineer

$85,200 - $162,500 per year

Intel Corporation

Job Details: Job Description:  Join our team as a Packaging Module Development Engineer, where you will play a pivotal...

Phoenix

23 days ago