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- Own and develop Die Attach and Flip Chip assembly processes end-to-end
- Drive process development, optimization, and yield improvement (~95%)
- Work in a high-mix, low-volume environment, managing multiple projects simultaneously
- Design and execute DOE (Design of Experiments) for new product introductions (NPI)
- Analyze yield issues and implement process improvements on the production line
- Collaborate with cross-functional teams (Sales, Ops, Quality, Engineering)
- Support RFQs with process inputs and technical feasibility
- Train technicians and operators on new processes and quality standards
- Contribute to advanced photonics and active alignment assembly (training provided)
- Work with or learn advanced tools like die bonders, pick-and-place, alignment systems
- 2+ years of hands-on experience in Die Attach and Flip Chip process development
- Proven ability to develop and optimize processes with high yield (~95%)
- Experience in semiconductor packaging or related micro-assembly (RF, MEMS, etc.)
- Strong understanding of DOE, SPC, and yield improvement methodologies
- Ability to multi-task in a fast-paced, high-mix environment
- Exposure to equipment like ESEC/Evo, Hesse, Amicra, FineTech, Disco, ficonTEC (or similar)
- Basic to intermediate exposure to software/tools (SolidWorks, MATLAB, Python, LabVIEW)
- Background in optics/photonics is a plus (training will be provided)
- Bachelor’s degree in Engineering or related field
Must-Have
- Hands-on Die Attach (DA) & Flip Chip (FC) process development
- Strong yield improvement (SPC, DOE) experience
- Ability to work in high-mix, low-volume environment
- Multi-project handling & fast learning ability
- Strong ownership mindset & commitment
Nice-to-Have
- Photonics / Optoelectronics exposure or coursework
- Experience with active alignment systems
- Familiarity with advanced assembly equipment (Evo, Hesse, Amiga, FineTech, Disco, ficonTEC)
- Exposure to micro-assembly (RF, MEMS, optics)
- Programming/tools: Python, MATLAB, LabVIEW, SolidWorks
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