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Role Purpose
Lead Power Integrations’ global IC design organization, ensuring the successful and predictable execution of all silicon development aligned to product architectures and Market-driven roadmaps.
This role owns the delivery of high-quality, manufacturable ICs, translating product and system requirements into silicon while maintaining strong execution discipline, risk management, and cross-functional alignment.
Working closely with Product & Technology Development, Marketing, Operations, and Business Units, this leader ensures silicon delivery meets performance, cost, quality, and schedule commitments.
Business Ownership & Impact
•   Own execution and delivery of all IC development programs.
•   Ensure predictable silicon delivery aligned to product commitments.
•   Drive improvements in:o   First-pass silicon success
o   Development cycle time
o   Design productivity and reuse
•   Balance design innovation with execution risk and schedule confidence.
•   Ensure designs meet:
o   Performance targets
o   Cost and area targets
o   Manufacturability and yield requirements
Core Responsibilities
IC Design Execution & Delivery
•   Lead all IC development across:
o   Analog design
o   Digital design
o   Mixed-signal integration
o   Design verification
o   CAD/Layout
o   Design reuse
•   Ensure high-quality execution from specification through tape-out and silicon validation.
•   Deliver designs that meet schedule, performance, cost, and quality targets.
Alignment to Product & Marketing Requirements
•   Work closely with Product & Technology and Marketing to ensure clear translation of roadmap requirements into design specifications.
•   Provide early input on feasibility, risk, and trade-offs.
•   Maintain alignment between architecture intent and silicon implementation.
Design Methodology & Productivity
•   Establish best-in-class design methodologies, tools, and flows.
•   Drive improvements in:
o   Design reuse
o   Verification coverage
o   Silicon iterationsÂ
o   Time-to-functioning silicon
•   Build scalable design infrastructure to support future growth.
Cross-Functional Integration
•   Partner closely with:
o   Product & Technology (architecture and requirements)
o   Marketing (roadmap alignment)
o   Operations (process, yield, cost, backend execution)
o   Business Units (application needs and priorities)
•   Ensure tight alignment between design, manufacturing, and system requirements.
Risk Management & Predictable Execution
•   Implement disciplined design and verification processes to reduce execution risk.
•   Identify and manage technical risks early in the development cycle.
•   Ensure high confidence in tape-out schedules and silicon success.
•   Drive a culture of accountability and delivery predictability.
Organizational Leadership
•   Lead global IC design teams across regions.
•   Build a strong technical culture focused on:
o   Quality
o   Execution discipline
o   Risk management
o   Design reuse
o   Continuous improvement
•   Recruit, develop, and retain top engineering talent.
Ideal Profile
•   15+ years of experience in IC design (analog, mixed-signal, or power ICs).
•   Proven leadership of global IC design teams.
•   Deep expertise in:
o   High-voltage / power IC design
o   Mixed-signal integration
o   Semiconductor processes (BCD, HV, GaN preferred)
•   Strong track record of delivering silicon on schedule with high quality.
•   Experience improving design productivity and execution predictability.
•   Strong cross-functional collaboration skills across product, marketing, and operations.
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