We are seeking a highly experienced Lead Application Engineer to join Advantest’s Research & Ventures (R&V) team, developing and delivering advanced semiconductor test solutions on the Advantest V93000 Test Platform, with a strong focus on wafer-level (die-level) testing, thermal management, and high-performance digital devices.
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As part of the R&V team, you will have the opportunity to work on new and cutting-edge technologies and play a critical role in incubating, enabling, and bringing new products and capabilities to our customers. You will be a key technical contributor, working closely with R&D, cross-functional teams and customers to transform early concepts and advanced technologies into robust, scalable test solutions.
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You will independently design, implement, debug, and optimize test programs for silicon devices at the wafer level, while managing the thermal and electrical challenges.
The ideal candidate is a self-starter with strong SmarTest8 expertise, hands-on experience with die-level probers, and a passion for innovation—capable of leading technical discussions, influencing research, and delivering end-to-end solutions that shape the future of semiconductor testing.
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Responsibilities
- Lead the design, development, execution, and debugging of test programs on the Advantest V93000 platform
- Develop test programs, test methods, and reusable libraries using C++ and Java in SmarTest8
- Own wafer-level (die-level) test program development, including silicon bring-up, characterization, and support using die-level probers
- Manage and optimize thermal aspects of device testing, including temperature control strategies, thermal limitations, and correlation of electrical behavior across temperatures
- Work with high-power devices and develop test programs that actively manage power dissipation and thermal constraints during testing, ensuring safe operation, test integrity, and repeatable results across operating conditions
- Execute, debug, and resolve test program issues on both, offline and online systems
- Provide end-to-end ownership of test solutions, spanning ATE hardware, probers, load boards, probe cards, and test software
- Debug and resolve complex issues across hardware, software, silicon, and thermal domains
- Act as the primary technical interface for cross-functional teams, leading technical discussions, design reviews, and root-cause analysis sessions
- Support requirements analysis, benchmark testing, demonstrations, and training
- Collaborate closely with R&D, COE, and global engineering teams to develop next-generation wafer-level and system-level test solutions
- Partner with leading customers on next‑generation high‑power devices to co‑define advanced test requirements, exploring power delivery, thermal management, and wafer‑level test methodologies on the V93000 platform
- Lead customer‑facing engagements—including technical discussions, deep‑dives, and pilot programs—to prototype and validate high‑power, thermally‑constrained test solutions, transforming early concepts into scalable test programs, methods, and reusable frameworks.
Minimum Qualifications
- Bachelor’s degree (or higher) in Electrical Engineering, Computer Engineering, Computer Science, or a related field
- 5–7 years of hands-on experience developing and debugging test programs, test methods, and libraries on V93000 using SmarTest8
- Proficiency in Java for test program and test method development
- Hands-on experience with wafer-level (die-level) testing, including working directly with silicon and dies using die-level probers
- Proven experience managing thermal aspects of test devices, including temperature-dependent behavior and test execution across thermal conditions
- Hands-on experience working with V93000 hardware, load boards, probe cards, and prober integration
- Proven ability to debug and resolve issues end-to-end, spanning software, hardware, silicon, and thermal domains
- Ability to lead technical discussions and influence technical decisions
- Ability to work both independently and within a team in a fast-paced, changing environment
- Self-motivated, proactive, and execution-focused
Preferred Skills
- Experience developing test programs for digital and high-performance compute (HPC) devices
- Deep understanding of V93000 system architecture, wafer-level test flows, and best practices
- Strong understanding of high power devices and their thermal behavior at wafer level
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