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Lead Hardware System Architect

Bolt Graphics
Posted 17 days ago, valid for 9 days
Location

Sunnyvale, CA 94086, US

Salary

$200,000 - $250,000 per year

Contract type

Full Time

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Sonic Summary

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  • The Lead Hardware System Architect will oversee the hardware development lifecycle for advanced graphics compute platforms and high-performance GPU servers.
  • This role requires a minimum of 8 years of hardware design experience, particularly with high-performance graphics hardware and GPU motherboards.
  • Key responsibilities include architecting high-speed topologies, managing complex hardware debug, and ensuring compliance with manufacturing standards.
  • The position offers a competitive salary range of $200,000 to $250,000 per year, depending on qualifications and experience.
  • The company values diversity and inclusion, offering comprehensive benefits including medical coverage, equity options, and a 401(k) match.

About the role:

As the Lead Hardware System Architect, you will own the end-to-end hardware development lifecycle for our next-generation graphics compute platforms, high-performance GPU servers, and ultra-high-speed PCIe graphics form factors. You will act as the technical bridge between advanced graphics silicon packaging and system-level deployment, driving physical architecture, functional partitioning, and high-speed fabric optimization for massive graphics workloads and real-time rendering infrastructure.

In this role, you will not just oversee board layouts; you will define the physical topologies that enable cutting-edge graphics compute scaling. You will serve as the ultimate technical escalation point for our global JDM/ODM engineering partners, steering them through complex bring-up, signal integrity boundaries, and root-cause failure analysis to deliver flawless graphics hardware on schedule. This role is on-site, 5 days a week.


What you'll do:

1. Physical System Architecture & High-Performance Graphics Design

  • Architect the Platform: Drive system-level architectural trade-offs, balancing high-performance GPU silicon package constraints, high-speed routing density, thermal mechanics, and ultra-high-density power delivery networks (PDNs).
  • Own High-Speed Topologies: Design and optimize complex PCB topologies utilizing PCIe Gen 5/Gen 6 (CEM specifications) and proprietary/consortium scale-up interconnect fabrics designed for parallel compute and graphics scaling (e.g., NVLink, Infinity Fabric, UA Link).
  • Systemic Co-Design: Collaborate with Silicon, Signal/Power Integrity (SI/PI), and Thermal/Mechanical teams to define robust board stack-ups, low-loss material selection, and multi-phase power zones handling massive transient loads from modern graphics processors.
  • Management Integration: Ensure seamless integration of out-of-band telemetry and management infrastructure, designing physical routing for Baseboard Management Controllers (BMCs), SPI, and I2C/SMBus topologies.

2. Technical JDM/ODM & Supplier Governance

  • Lead Technical Enablement: Serve as the primary technical authority interfacing with international JDM/ODM layout and hardware engineering teams.
  • Triage & Failure Analysis: Lead complex hardware debug, component-level troubleshooting, and failure analysis (FA) during early-phase platform bring-up and validation of graphics compute hardware.
  • DFX & Execution Governance: Enforce rigorous design reviews and strict compliance with DFX (Manufacturing, Assembly, Test, and Automation) standards to ensure high-yield transitions from EVT/DVT to High-Volume Manufacturing (HVM).

Qualifications:

  • Education: Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related technical discipline.
  • Experience: 8+ years of hardware design experience, with a proven track record of shipping high-performance graphics hardware, GPU motherboards, or high-density parallel compute accelerator boards.
  • Fabric & Bus Expertise: Deep, hands-on experience designing with PCIe Gen 5/6 and high-speed serdes (112G/224G PAM4 architectures). Familiarity with CXL or scalable interconnect fabrics is highly desired.
  • Advanced Power & SI/PI: Strong understanding of high-frequency PCB layout constraints, via optimization, and power delivery networks capable of handling extreme di/dt step loads inherent to dynamic graphics workloads.
  • Hardware Tooling: Proficiency with advanced EDA tools (e.g., Cadence Allegro, OrCAD) and familiarity with simulation tools for validating physical design assumptions.
  • Global Vendor Triage: Experience directing overseas ODM engineering teams through architectural definition, layout execution, and laboratory hardware triage.

Preferred Qualifications 

  • Direct experience with Open Compute Project (OCP) standards or industry-standard multi-GPU form factors.
  • Familiarity with liquid cooling or advanced phase-change thermal infrastructure and its unique spatial and material constraints on physical board design.
  • Hands-on lab experience utilizing high-speed validation equipment (e.g., oscilloscopes, VNAs, BERTs) for signal and power verification on graphics hardware.

Compensation Range: $200,000–$250,000 per year (California). This range represents the anticipated base pay for this role; the final offer may vary based on qualifications, experience, and location. This role is onsite - 5 days a week.

Benefits:

  • Medical, Dental, & Vision - 100% covered premiums
  • Equity - Stock Options
  • 401(k) match
  • WFH Equipment Reimbursement


Bolt is committed to building a diverse and inclusive environment in which we recognize and value each other’s differences as well as fostering a culture that promotes its core values: Professionalism, Integrity, and Respect. As an equal opportunity employer, all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, genetic information, national origin, age, disability, or status as a protected veteran.




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