Responsibilities
- In this role, you will apply your end-to-end expertise and ownership through the NPI engineering and production ramp phases for RGB microLEDs, from epitaxy through the device fabrication process and end-of-line test. You will define and own key performance indicators (KPIs) such as yield, process capability, cycle time and OEE, and will devise and lead improvement plans to meet these targets. You will work closely with the external partner to proactively identify and resolve technical and operational risks, and drive containment, failure analysis and corrective actions for technical issues. You will work with internal customers to understand and address downstream technical issues related to the microLED design and process, and drive convergence on device-level specifications based on evolving system requirements. Additionally, you will own the yield bridge and drive actions towards meeting targets
- External Partner Management: Lead technical engagement for sustaining and manufacturing operations at a partner site
- NPI and Manufacturing: Drive high-volume ramp and MP readiness, sustain production
- Yield & Performance: Define and own key performance indicators (KPIs); execute yield roadmap, drive root cause analysis, drive cycle time and cost reduction
- Manufacturing rigor: Establish and drive FMEA, SOPs, process characterization reports, control plan, OCAP, etc
- Cross-Functional Leadership: Drive cross-functional teams, resolve downstream integration issues, drive spec convergence, report status to management
- Roadmapping: Drive long-term microLED manufacturing roadmap for cost reduction
- Travel ~25% to external partner site(s) for onsite-support
Minimum Qualifications
- Masters or PhD in microelectronics, physics, electrical engineering, materials science, or a related field
- 5+ years of experience with optoelectronic device fabrication and/or process integration
- 5+ years of experience with managing external partners (e.g., contract manufacturers)
- 2+ years of experience managing and analyzing large data sets, specifically for yield analysis and management
- 2+ years of experience with Design of Experiment (DOE), structured problem solving and statistical data analysis (JMP, Minitab, Tableau, etc.) and statistical process control (SPC) methodology
- Broad experience and expertise in semiconductor materials, device fabrication processes, process integration and device architecture
- Understanding of failure analysis techniques including SEM, TEM, EDS, etc
- Understanding of factory operational readiness metrics including IQC, IPQC, OQC, FMEA, control plans, yield, GRR, UPH, OEE, MMR)
- Understanding of cleanroom management principles
- Experience working in cross-discipline teams and drive convergence on solutions that optimize across multiple technology layers
Preferred Qualifications
- Experience in III-V semiconductor optoelectronic devices (GaN/GaAs material systems)
- Experience with microLED process development or process integration
- Experience in optoelectronic device packaging and assembly processes
- Background in semiconductor device physics and/or materials science
- Experience with emerging display technologies and associated fabrication and integration challenges
- Experience with technology transfer and ramp to high-volume manufacturing
$173,000/year to $245,000/year + bonus + equity + benefits
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