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Thin Films Module Development Engineering

INTEL
Posted 2 days ago, valid for 19 days
Location

Vernonia, OR, US

Salary

$148,100 - $209,100 per year

Contract type

Full Time

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Sonic Summary

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  • The Module Development Engineer at Intel will focus on advancing semiconductor manufacturing technologies and optimizing processes for cutting-edge device architectures.
  • Candidates must have a Bachelor's degree in a relevant STEM field with 5+ years of experience, or a Master's degree with 3+ years, or a PhD with 1+ year of experience.
  • The role involves leading the design of manufacturing processes, conducting feasibility studies, and collaborating with suppliers and cross-functional teams to enhance production efficiency.
  • Intel offers a competitive annual salary range of $148,100.00 to $209,100.00, depending on location and experience.
  • This position requires on-site presence and contributes directly to Intel's innovation and leadership in the semiconductor industry.

Job Description


The Role and Impact


As a Module Development Engineer, you will play a crucial role in driving advancements in Intel's semiconductor manufacturing technologies. You will focus on developing and optimizing advanced manufacturing processes to enable cutting-edge device architectures. Leveraging your expertise in process integration, equipment solutions, and feasibility studies, you will help shape Intel's future technology roadmap while ensuring robust and scalable solutions for high-volume manufacturing. Your work will directly contribute to Intel's innovation and leadership in the semiconductor industry.

Business group


You will join Intel's Advanced Packaging Technology Development organization, which focuses on creating future generations of packaging technologies to meet Intel's manufacturing and innovation goals. This team develops and enables high-volume manufacturing processes while driving advancements in semiconductor technology to reinforce Intel's leadership position in the industry. Together, the group ensures the successful integration of advanced technologies while delivering solutions that align with Intel's broader vision of technological innovation.

Key Responsibilities


- Lead the design and development of advanced manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
- Drive technology development and enablement for both high-volume manufacturing and future technologies.
- Conduct feasibility studies and simulations to achieve desired device specifications.
- Develop and execute technology roadmaps to guide future manufacturing needs and set industry standards.
- Collaborate with equipment and material suppliers to design and implement innovative process technologies.
- Optimize production efficiency, manufacturing techniques, and output for existing and new products.
- Utilize statistical process control and data analytics to enhance process stability and drive continuous improvements.
- Recommend and implement modifications to operational equipment to improve efficiency and scalability.
- Partner with cross-functional teams to ensure alignment on process integration and project deliverables.


Qualifications


Qualifications

 

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.


Minimum Qualifications


- Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related STEM discipline with 5+ years of relevant experience.
- OR Master’s degree in the same fields with 3+ years of relevant experience.
- OR PhD in the same fields with 1+ years of relevant experience.

Experience listed above should be a combination of the following:


- Proven expertise in manufacturing process development, statistical process control, and/or data analytics.
- Experience in wafer-level assembly, semiconductor processing, or advanced packaging technology development.
- Experience with films processing techniques such as CVD/PECVD, thermal/PE ALD and PVD.

Preferred Qualifications


- Experience in wafer-level assembly, advanced packaging, or related technologies such as hybrid bonded interconnects.
- Demonstrated success in leading programs from strategy formation to high-volume production.
- Recognized technical leadership with a proven track record of solving complex engineering challenges.
- Strong collaboration skills across functional areas like yield, operations, and supplier management.

Intel is looking for innovative engineers who are passionate about advancing semiconductor technology. Bring your expertise and creativity to our team and help shape the future of technological innovation. Apply now to make an impact at Intel.


Inside this Business Group


Intel makes possible the most amazing experiences of the future. You may know us for our processors. But we do so much more. Intel invents at the boundaries of technology to make amazing experiences possible for business and society, and for every person on Earth. Harnessing the capability of the cloud, the ubiquity of the Internet of Things, the latest advances in memory and programmable solutions, and the promise of always-on 5G connectivity, Intel is disrupting industries and solving global challenges. Leading on policy, diversity, inclusion, education and sustainability, we create value for our stockholders, customers, and society.


Posting Statement


All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits


We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.



Annual Salary Range for jobs which could be performed in the US $148,100.00-$209,100.00
*Salary range dependent on a number of factors including location and experience


Working Model


This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.



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By applying, a Intel account will be created for you. Intel's Privacy Policy will apply.

SonicJobs' Terms & Conditions and Privacy Policy also apply.