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Optical Packaging Engineer

Irradiant Technologies Inc.
Posted 11 days ago, valid for 17 days
Location

Waltham, MA 02454, US

Salary

Competitive

Contract type

Full Time

Paid Time Off

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Sonic Summary

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  • The Integrated Optical Packaging Engineer will lead the design and development of packaging for complex optical and electrical components in integrated optical systems.
  • Candidates must have at least 5 years of experience in semiconductor, optical MEMS, or integrated photonics packaging, along with a Bachelor's or Master's degree in a relevant field.
  • The role involves collaboration with cross-functional teams, utilizing CAD and simulation tools for design and analysis, and is primarily on-site with some remote work potential.
  • The salary range for this position is between $110,000 and $150,000, with a commitment to equitable compensation and various benefits offered to employees.
  • Irradiant Technologies is dedicated to diversity and inclusion, encouraging applicants from all backgrounds to apply.

Position Summary:

The Integrated Optical Packaging Engineer role leads the design, simulation, material specification and assembly process development for packaging complex, novel printed optical and electrical breadboard components within the context of integrated optical systems such as, fiber interconnects, photonic integrated circuits (PICs), optical imaging and metrology systems, and radio frequency (RF) components and subsystems such as, phased-array antenna, meta surface and devices.  This role is responsible for the entire packaging lifecycle, from conceptual design to high-volume manufacturing, focusing on cost-effective, reliable, thermally and environmentally stable, precisely aligned solutions developed by collaborating with internal cross-functional teams and experienced outsourced partners.  The ideal candidate will be comfortable working at the intersection of optics, electronics, precision mechanics, and nanofabrication.  The position is primarily on-site, with the potential for part-time remote work.

What you'll be doing

  • Design & Simulation: Lead the design and development of optical packages, utilizing CAD and FEA tools for structural and thermal analysis.
  • Optical Coupling: Develop, optimize, and document, low-loss, high-precision fiber-to-chip, lens, and free-space optical coupling methods.
  • Materials Specification: Define adhesives, epoxies and environmentally robust materials used to seal a novel, 3D printed, volumetric subsystem
  • Process Development: Define and validate assembly techniques, including bonding, environmental sealing, flip-chip, and die-level integration.
  • Yield Improvement: Analyze and improve assembly yields through experimental design (DOE), failure analysis (FA), and structural/material characterization.
  • Environmental Robustness: Define product environmental reliability goals, validation approaches and manages testing.  
  • Manufacturing Readiness: Collaborate with assembly partners (OSAT) and manufacturing teams to transition prototypes to high-volume production.
  • Documentation: Maintain detailed design documents, process specifications, and test reports. 

What experience you'll need

  • 5+ years of experience in die-level semiconductor, optical MEMS, or integrated photonics packaging for systems integration.
  • Bachelor’s or Master’s degree in Engineering, Physics, Applied Physics, Optical Engineering, Electrical Engineering, or a related field.
  • Strong communication skills with the ability to work in a multi-disciplined environment is required.
  • Expert-level knowledge of CAD software, such as SolidWorks and simulation software, such as ANSYS, COMSOL.
    • Optical modeling with design tools such as Zemax is a plus.
  • High-precision alignment and optical assembly in a prototype and production setting; comfortable troubleshooting and with diagnostic metrology.
  • Experience working in a startup or fast-paced R&D environment is preferred.

Desirable:

  • Ph.D. with 5+ years of industry experience.
  • Experience with automated, high-volume manufacturing (HVM) processes.
  • Experience with optical MEMS device characterization and reliability testing
  • Background in aerospace, automotive, medical or metrology device manufacturing. 

Company Overview

Irradiant Technologies is pioneering the future of nano-optics and photonics with our proprietary 3D nanofabrication platform. Our technology enables the creation of optical components with geometries and refractive index profiles previously unattainable, opening doors to entirely new classes of photonic devices. By redefining what is possible in optical design and manufacturing, we are accelerating innovations in sensing, communication, imaging, display, and computation. As we transition from R&D to productization, we are expanding our engineering team to support the development of robust, integrated photonic systems.

Compensation and Benefits

The salary range for this role is $110,000 - $150,000 and we are committed to equitable compensation across our company. We offer multiple healthcare schemes and an annual reimbursement, to give our employees greater flexibility with the benefits that meet their needs. We offer a flexible Paid Time Off policy and encourage people to take regular vacation.

Equal Employment Opportunity

Irradiant Technologies is an equal opportunity employer. We are committed to creating a diverse and inclusive team free from discrimination or harassment. We encourage candidates of any race, color, religion, sexual orientation, gender identity, national origin, veteran or disability status to apply. Applicants with a disability are encouraged to contact us with any requests for accommodation.




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