Packaging Module Development Engineer

Job Description

The world is transforming - and so is Intel. Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technology advancements and experiences in the world. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings. We work every single day to design and manufacture silicon products that empower people's digital lives. Come join us and do something wonderful.

Note: This role requires regular onsite presence to fulfill essential job responsibilities.

• Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
• Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
• Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
• Develops and maintains equipment to evaluate silicon and package technologies under simulated field use conditions, such as heat, humidity, temperature cycle, and dynamic forces.
• Ensures manufacturability of physical layout of package design and oversees the cycle of manufactured package processes, procedures and flows.
• Establishes material specifications for contract assemblers and raw material vendors and interfaces with supplier quality and procurement teams to ensure material quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods.
• Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with packaging quality and reliability.
• Sets reliability requirements to meet customer needs and influences design, material selection and process development to meet those needs, based on fundamental understanding of failure mechanisms.
• Leads efforts towards innovating, problem solving, developing, and continuously improving equipment and processes using experimental design and statistical methods.
• Provides consultation concerning packaging problems and improvements in the packaging process, and responds to customer/client requests or events as they occur.
• Delivers standardization in product qualification, manufacturing quality systems, and methods and continuously engages with packaging technology development and partner engineering groups on process/technology maturity for products towards key risk areas in meeting product milestones.

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Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your degree, research and or relevant previous job and or internship experiences.

Minimum Qualifications:

• Bachelor's degree with 4+ years of experience or Master's degree with 2+ years of experience in Engineering or Physics or Computer Science or related field.
• US Citizenship required.
• Ability to obtain and maintain a US Government Security Clearance.
• 1+ years of experience in manufacturing related inspection (wafer, package, component, part, etc.).

Preferred Qualifications:

• Fundamental physical processes, troubleshoot complex ultra-high precision equipment across a variety of disciplines including optical, laser, motion or electrical systems.
• Statistical principles, process control (SPC) and Design of Experiments (DOE).
• Fundamental scientific and engineering principles to develop novel design solutions for high volume manufacturing processes.
• Semiconductor devices and packing technology.
• Data science and statistics tools (Python is highly preferred).
• Data management and visualization experience.
• Dimensional management for package features and planes.
• Optics fundamentals as applied to imaging techniques (light sources, resolutions, algorithm applications), light-matter interaction.
• Machine Vision techniques, OpenCV experience and CNN Image Classification.
• Demonstrated projects that combine engineering with basic computer software development.
• Demonstrated projects that utilize computer vision, either with OpenCV (or equivalent) and classification and object detection machine learning models.

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